Issued Patents All Time
Showing 326–350 of 498 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8851133 | Method and apparatus of holding a device | Martin Liu, Chung-Yi Yu, Che Ying Hsu, Yeur-Luen Tu, Da-Hsiang Chou | 2014-10-07 |
| 8853811 | Image sensor trench isolation with conformal doping | Chih-Yu Lai, Yeur-Luen Tu, Chih-Hui Huang, Cheng-Ta Wu, Luan C. Tran | 2014-10-07 |
| 8853768 | Method of fabricating MONOS semiconductor device | Chung-Chiang Min, Tsung-Hsueh Yang, Shih-Chang Liu | 2014-10-07 |
| 8846129 | Biological sensing structures and methods of forming the same | Hung-Hua Lin, Li-Cheng Chu, Ming-Tung Wu, Yuan-Chih Hsieh, Lan-Lin Chao | 2014-09-30 |
| 8836055 | MEMS structures and methods for forming the same | Lung Yuan Pan, Lan-Lin Chao | 2014-09-16 |
| 8822237 | Hole first hardmask definition | Wei-Hang Huang, Shih-Chang Liu, Chern-Yow Hsu, Fu-Ting Sung | 2014-09-02 |
| 8816358 | Plasmonic nanostructures for organic image sensors | Shu-Ju Tsai, Yeur-Luen Tu, Cheng-Ta Wu, Cheng-Yuan Tsai, Xiaomeng Chen | 2014-08-26 |
| 8809123 | Three dimensional integrated circuit structures and hybrid bonding methods for semiconductor wafers | Ping-Yin Liu, Xin-Hua Huang, Lan-Lin Chao | 2014-08-19 |
| 8802538 | Methods for hybrid wafer bonding | Ping-Yin Liu, Jen-Cheng Liu, Xiaomeng Chen, Xin-Hua Huang, Hung-Hua Lin +1 more | 2014-08-12 |
| 8802457 | Backside surface treatment of semiconductor chips | Chih-Yu Lai, Cheng-Ta Wu, Kai-Chun Hsu, Yeur-Luen Tu, Ching-Chun Wang | 2014-08-12 |
| 8790946 | Methods of bonding caps for MEMS devices | Xin-Hua Huang, Ping-Yin Liu, Li-Cheng Chu, Yuan-Chih Hsieh, Lan-Lin Chao +1 more | 2014-07-29 |
| 8791571 | System and method for preventing etch arcing during semiconductor processing | Hung-Wen Hsu, Tung-Ting Wu, Jiech-Fun Lu, Yeur-Luen Tu | 2014-07-29 |
| 8791504 | Substrate breakdown voltage improvement for group III-nitride on a silicon substrate | Chi-Ming Chen, Po-Chun Liu, Hung-Ta Lin, Chin-Cheng Chang, Chung-Yi Yu +1 more | 2014-07-29 |
| 8772831 | III-nitride growth method on silicon substrate | Chi-Ming Chen, Po-Chun Liu, Hung-Ta Lin, Chin-Cheng Chang, Chung-Yi Yu +1 more | 2014-07-08 |
| 8759225 | Method to form a CMOS image sensor | Chung Chien Wang, Yeur-Luen Tu, Cheng-Ta Wu, Jiech-Fun Lu, Chun-Wei Chang +2 more | 2014-06-24 |
| 8735207 | Method to avoid fixed pattern noise within backside illuminated (BSI) complementary metal-oxide-semiconductor (CMOS) sensor array | Chung Chien Wang, Yeur-Luen Tu | 2014-05-27 |
| 8728845 | Method and apparatus for selectively removing anti-stiction coating | Shih-Wei Lin, Ping-Yin Liu, Lan-Lin Chao, Jung-Huei Peng | 2014-05-20 |
| 8723185 | Reducing wafer distortion through a high CTE layer | Chi-Ming Chen, Chung-Yi Yu, Ho-yung David Hwang | 2014-05-13 |
| 8710560 | Embedded bonding pad for image sensors | Yuan-Chih Hsieh, Shih-Chang Liu, Shih-Chi Fu, Tzu-Hsuan Hsu, Chung-Yi Yu +1 more | 2014-04-29 |
| 8685783 | Phase change memory cell | Ming-Huei Shen, Tsun-Kai Tsao, Shih-Chang Liu | 2014-04-01 |
| 8647962 | Wafer level packaging bond | Martin Liu, Richard Chu, Hung-Hua Lin, Hsin-Ting Huang, Jung-Huei Peng +3 more | 2014-02-11 |
| 8629531 | Structure and method to reduce wafer warp for gallium nitride on silicon wafer | Ming Chyi Liu, Hsieh Ching Pei, Jiun-Lei Jerry Yu, Chi-Ming Chen, Shih-Chang Liu +1 more | 2014-01-14 |
| 8628990 | Image device and methods of forming the same | Cheng-Ta Wu, Sheng Chiao, Yeur-Luen Tu, Shuang-Ji Tsai | 2014-01-14 |
| 8610227 | Formation of embedded micro-lens | Shih Pei Chou, Shih-Chang Liu, Yeur-Luen Tu | 2013-12-17 |
| 8598687 | Semiconductor having a high aspect ratio via | Yuan-Chih Hsieh, Richard Chu, Ming-Tung Wu, Martin Liu, Lan-Lin Chao | 2013-12-03 |