Issued Patents All Time
Showing 51–75 of 92 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510912 | Image sensor device and method | Kuo-Chin Huang, Tzu-Jui Wang, Szu-Ying Chen, Dun-Nian Yaung, Jen-Cheng Liu +2 more | 2019-12-17 |
| 10475877 | Multi-terminal inductor for integrated circuit | Ching-Chung Hsu, Chung-Long Chang, Tsung-Yu Yang, Hung-Chi Li, Che-Yung Lin +1 more | 2019-11-12 |
| 10453813 | Contact pad for semiconductor device | Chang-Chia Huang, Tsung-Shu Lin, Wei-Cheng Wu | 2019-10-22 |
| 10290604 | Substrateless integrated circuit packages and methods of forming same | Lin-Chih Huang, Hung-An Teng, Hsin-Yu Chen, Tsang-Jiuh Wu | 2019-05-14 |
| 10269682 | Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devices | Chi-Hsi Wu, Shin-Puu Jeng, Tsung-Yu Chen, Wensen Hung | 2019-04-23 |
| 10164133 | Image sensor device and method | Kuo-Chin Huang, Tzu-Jui Wang, Szu-Ying Chen, Dun-Nian Yaung, Jen-Cheng Liu +2 more | 2018-12-25 |
| 10163861 | Semiconductor package for thermal dissipation | Chen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh, Hsien-Wei Chen, Ming-Yen Chiu | 2018-12-25 |
| 10153218 | Semiconductor structure and manufacturing method thereof | Tsung-Yu Chen, Wensen Hung, Hung-Chi Li, Tung-Liang Shao, Chih-Hang Tung | 2018-12-11 |
| 10062664 | Semiconductor packaging device with heat sink | — | 2018-08-28 |
| 9953948 | Pillar design for conductive bump | Cheng-Lin Huang, Po-Hao Tsai, Shang-Yun Hou, Jing-Cheng Lin, Shin-Puu Jeng | 2018-04-24 |
| 9842825 | Substrateless integrated circuit packages and methods of forming same | Lin-Chih Huang, Hung-An Teng, Hsin-Yu Chen, Tsang-Jiuh Wu | 2017-12-12 |
| 9806038 | Reinforcement structure and method for controlling warpage of chip mounted on substrate | Chen-Hua Yu, Shang-Yun Hou, Tsung-Shu Lin | 2017-10-31 |
| 9741638 | Thermal structure for integrated circuit package | Shin-Puu Jeng, Shang-Yun Hou, Way Lee Cheng | 2017-08-22 |
| 9722109 | Image sensor device and method | Kuo-Chin Huang, Tzu-Jui Wang, Szu-Ying Chen, Dun-Nian Yaung, Jen-Cheng Liu +2 more | 2017-08-01 |
| 9711478 | Semiconductor device with an anti-pad peeling structure and associated method | Chih-Kai Cheng, Shih-Wen Huang | 2017-07-18 |
| 9691686 | Contact pad for semiconductor device | Chang-Chia Huang, Tsung-Shu Lin, Wei-Cheng Wu | 2017-06-27 |
| 9640490 | Through silicon via keep out zone formation method and system | Hung-An Teng, Shang-Yun Hou, Shin-Puu Jeng | 2017-05-02 |
| 9613931 | Fan-out stacked system in package (SIP) having dummy dies and methods of making the same | Tsung-Shu Lin, Hsien-Wei Chen, Chang-Chia Huang | 2017-04-04 |
| 9508666 | Packaging structures and methods with a metal pillar | Chen-Hua Yu, Shin-Puu Jeng, Shang-Yun Hou, Kuo-Ching Hsu, Ying-Ching Shih +3 more | 2016-11-29 |
| 9496235 | Pillar design for conductive bump | Cheng-Lin Huang, Po-Hao Tsai, Shang-Yun Hou, Jing-Cheng Lin, Shin-Puu Jeng | 2016-11-15 |
| 9449947 | Semiconductor package for thermal dissipation | Chen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh, Hsien-Wei Chen, Ming-Yen Chiu | 2016-09-20 |
| 9443806 | Chip packages and methods of manufacturing the same | Shin-Puu Jeng, Tsung-Shu Lin, Chen-Hua Yu | 2016-09-13 |
| 9391000 | Methods for forming silicon-based hermetic thermal solutions | Jing-Cheng Lin | 2016-07-12 |
| 9385091 | Reinforcement structure and method for controlling warpage of chip mounted on substrate | Chen-Hua Yu, Shang-Yun Hou, Tsung-Shu Lin | 2016-07-05 |
| 9337123 | Thermal structure for integrated circuit package | Way Lee Cheng, Shang-Yun Hou, Shin-Puu Jeng | 2016-05-10 |