Issued Patents All Time
Showing 76–92 of 92 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9318528 | Image sensor device and method | Kuo-Chin Huang, Tzu-Jui Wang, Szu-Ying Chen, Dun-Nian Yaung, Jen-Cheng Liu +2 more | 2016-04-19 |
| 9159852 | Image sensor device and method | Kuo-Chin Huang, Tzu-Jui Wang, Szu-Ying Chen, Dun-Nian Yaung, Jen-Cheng Liu +2 more | 2015-10-13 |
| 9054166 | Through silicon via keep out zone formation method and system | Hung-An Teng, Shang-Yun Hou, Shin-Puu Jeng | 2015-06-09 |
| 9034695 | Integrated thermal solutions for packaging integrated circuits | Shang-Yun Hou, Shin-Puu Jeng | 2015-05-19 |
| 8901735 | Connector design for packaging integrated circuits | Chen-Hua Yu, Ying-Ching Shih, Po-Hao Tsai, Chin-Fu Kao, Cheng-Lin Huang +4 more | 2014-12-02 |
| 8865521 | 3D semiconductor package interposer with die cavity | Shin-Puu Jeng, Kim Hong Chen, Shang-Yun Hou, Chao-Wen Shih, Chen-Hua Yu | 2014-10-21 |
| 8836094 | Package device including an opening in a flexible substrate and methods of forming the same | Tsung-Shu Lin, Hung-An Teng, Sao-Ling Chiu, Shang-Yun Hou | 2014-09-16 |
| 8782593 | Thermal analysis of integrated circuit packages | Chung-Min Fu, Wan-Yu Lo, Meng-Fu You, Po-Hsiang Huang | 2014-07-15 |
| 8664760 | Connector design for packaging integrated circuits | Chen-Hua Yu, Shin-Puu Jeng, Shang-Yun Hou, Kuo-Ching Hsu, Ying-Ching Shih +4 more | 2014-03-04 |
| 8610285 | 3D IC packaging structures and methods with a metal pillar | Chen-Hua Yu, Shin-Puu Jeng, Shang-Yun Hou, Kuo-Ching Hsu, Ying-Ching Shih +3 more | 2013-12-17 |
| 8604619 | Through silicon via keep out zone formation along different crystal orientations | Hung-An Teng, Shang-Yun Hou, Shin-Puu Jeng | 2013-12-10 |
| 8557631 | Interposer wafer bonding method and apparatus | Chen-Hua Yu, Chien-Chia Chiu | 2013-10-15 |
| 8519537 | 3D semiconductor package interposer with die cavity | Shin-Puu Jeng, Kim Hong Chen, Shang-Yun Hou, Chao-Wen Shih, Chen-Hua Yu | 2013-08-27 |
| 8482922 | Microfins for cooling an ultramobile device | Zhihua Li, Jack Hu, Hakan Erturk, George Chen | 2013-07-09 |
| 8381994 | Data storage device, stacking method thereof, and data storage device assembly | — | 2013-02-26 |
| 8054629 | Microfins for cooling an ultramobile device | Zhihua Li, Xuejiao Hu, Hakan Erturk, George Chen | 2011-11-08 |
| 7662501 | Transpiration cooling and fuel cell for ultra mobile applications | Xuejiao Hu, Zhihua Li, Soumyadipta Basu | 2010-02-16 |