Issued Patents All Time
Showing 26–50 of 92 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11768338 | Optical interconnect structure, package structure and fabricating method thereof | Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Hung-Yi Kuo +5 more | 2023-09-26 |
| 11754780 | Semiconductor package and manufacturing method thereof | Chung-Ming Weng, Hua-Kuei Lin, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai +5 more | 2023-09-12 |
| 11686908 | Photonic semiconductor device and method of manufacture | Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Hung-Yi Kuo +3 more | 2023-06-27 |
| 11664325 | Semiconductor structure and method of fabricating the same | Tzu-Sung Huang, Hsiu-Jen Lin, Hui-Jung Tsai, Hung-Yi Kuo, Hao-Yi Tsai +4 more | 2023-05-30 |
| 11640935 | Semiconductor package and manufacturing method thereof | Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Hung-Yi Kuo +7 more | 2023-05-02 |
| 11635566 | Package and method of forming same | Chih-Hsuan Tai, Chung-Ming Weng, Hung-Yi Kuo, Hao-Yi Tsai, Chung-Shi Liu +1 more | 2023-04-25 |
| 11614592 | Semiconductor devices and methods of manufacture | Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Hung-Yi Kuo +4 more | 2023-03-28 |
| 11594520 | Semiconductor package for thermal dissipation | Chen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh, Hsien-Wei Chen, Ming-Yen Chiu | 2023-02-28 |
| 11587883 | Semiconductor device and method of making the same | Hau Tao, Yung-Tien Kuo | 2023-02-21 |
| 11532596 | Package structure and method of forming the same | Tsung-Yuan Yu, Hung-Yi Kuo, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu | 2022-12-20 |
| 11527502 | Contact pad for semiconductor device | Chang-Chia Huang, Tsung-Shu Lin, Wei-Cheng Wu | 2022-12-13 |
| 11521959 | Die stacking structure and method forming same | Chen-Hua Yu, Hung-Yi Kuo, Chung-Shi Liu, Hao-Yi Tsai, Tsung-Yuan Yu +1 more | 2022-12-06 |
| 11506843 | Semiconductor device having photonic and electronic dies and an optical fiber assembly creating an air gap | Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Hung-Yi Kuo +4 more | 2022-11-22 |
| 11410932 | Semiconductor device and method of manufacturing the same | Ming Hung Tseng, Hao-Yi Tsai | 2022-08-09 |
| 11251119 | Package structure, package-on-package structure and method of fabricating the same | Tsung-Yuan Yu, Hung-Yi Kuo, Hao-Yi Tsai, Ming Hung Tseng | 2022-02-15 |
| 11244906 | Semiconductor structure and method of fabricating the same | Tzu-Sung Huang, Hsiu-Jen Lin, Hui-Jung Tsai, Hung-Yi Kuo, Hao-Yi Tsai +4 more | 2022-02-08 |
| 11139249 | Semiconductor devices and methods of forming the same | Chen-Hua Yu, Hung-Yi Kuo, Chung-Shi Liu, Hao-Yi Tsai, Tsung-Yuan Yu | 2021-10-05 |
| 11121052 | Integrated fan-out device, 3D-IC system, and method | Yu-Chia Lai, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu | 2021-09-14 |
| 11088125 | IPD modules with flexible connection scheme in packaging | Yu-Chia Lai, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu | 2021-08-10 |
| 11004771 | Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devices | Chi-Hsi Wu, Shin-Puu Jeng, Tsung-Yu Chen, Wensen Hung | 2021-05-11 |
| 10930605 | Contact pad for semiconductor device | Chang-Chia Huang, Tsung-Shu Lin, Wei-Cheng Wu | 2021-02-23 |
| 10910321 | Semiconductor device and method of making the same | Hau Tao, Yung-Tien Kuo | 2021-02-02 |
| 10879342 | Multi-terminal inductor for integrated circuit | Ching-Chung Hsu, Chung-Long Chang, Tsung-Yu Yang, Hung-Chi Li, Che-Yung Lin +1 more | 2020-12-29 |
| 10811389 | Semiconductor package for thermal dissipation | Chen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh, Hsien-Wei Chen, Ming-Yen Chiu | 2020-10-20 |
| 10672860 | Multi-terminal inductor for integrated circuit | Ching-Chung Hsu, Chung-Long Chang, Tsung-Yu Yang, Hung-Chi Li, Che-Yung Lin +1 more | 2020-06-02 |