Issued Patents All Time
Showing 51–75 of 106 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9805941 | Integrating atomic scale processes: ALD (atomic layer deposition) and ALE (atomic layer etch) | Keren Jacobs Kanarik, Jeffrey Marks, Harmeet Singh, Samantha Tan, Alexander Kabansky +3 more | 2017-10-31 |
| 9806252 | Dry plasma etch method to pattern MRAM stack | Samantha Tan, Taeseung Kim, Wenbing Yang, Jeffrey Marks | 2017-10-31 |
| 9779955 | Ion beam etching utilizing cryogenic wafer temperatures | Ivan L. Berry, III, Anthony J. Ricci | 2017-10-03 |
| 9735069 | Method and apparatus for determining process rate | Yassine Kabouzi, Luc Albarede, Andrew D. Bailey, III, Jorge Luque, Seonkyung Lee | 2017-08-15 |
| 9659783 | High aspect ratio etch with combination mask | Joydeep Guha, Sirish Reddy, Kaushik Chattopadhyay, Thomas W. Mountsier, Aaron Eppler +2 more | 2017-05-23 |
| 9627608 | Dielectric repair for emerging memory devices | Nerissa Draeger, Diane Hymes | 2017-04-18 |
| 9609730 | Adjustment of VUV emission of a plasma via collisional resonant energy transfer to an energy absorber gas | Andreas Fischer | 2017-03-28 |
| 9595452 | Residue free oxide etch | Chih-Hsun Hsu, Meihua Shen | 2017-03-14 |
| 9583339 | Method for forming spacers for a transistor gate | Nicolas Posseme, Thibaut David, Olivier Joubert, Srinivas D. Nemani, Laurent Vallier | 2017-02-28 |
| 9576811 | Integrating atomic scale processes: ALD (atomic layer deposition) and ALE (atomic layer etch) | Keren Jacobs Kanarik, Jeffrey Marks, Harmeet Singh, Samantha Tan, Alexander Kabansky +3 more | 2017-02-21 |
| 9570320 | Method to etch copper barrier film | Meihua Shen, Ji Zhu, Shuogang Huang, Baosuo Zhou, John Hoang +1 more | 2017-02-14 |
| 9553031 | Method for integrating germanides in high performance integrated circuits | Paul R. Besser | 2017-01-24 |
| 9536748 | Use of ion beam etching to generate gate-all-around structure | Ivan L. Berry, III | 2017-01-03 |
| 9460894 | Controlling ion energy within a plasma chamber | Harmeet Singh, Alex Paterson, Gowri Kamarthy | 2016-10-04 |
| 9449797 | Component of a plasma processing apparatus having a protective in situ formed layer on a plasma exposed surface | Harmeet Singh | 2016-09-20 |
| 9431268 | Isotropic atomic layer etch for silicon and germanium oxides | Ivan L. Berry, III, Meihua Shen, Alan M. Schoepp, David Hemker | 2016-08-30 |
| 9406535 | Ion injector and lens system for ion beam milling | Ivan L. Berry, III | 2016-08-02 |
| 9391267 | Method to etch non-volatile metal materials | Meihua Shen, Harmeet Singh, Samantha Tan, Jeffrey Marks, Richard Janek +2 more | 2016-07-12 |
| 9320387 | Sulfur doped carbon hard masks | Sirish Reddy, Alice Hollister | 2016-04-26 |
| 9257293 | Methods of forming silicon nitride spacers | Nicolas Posseme, Olivier Joubert, Thibaut David | 2016-02-09 |
| 9257638 | Method to etch non-volatile metal materials | Samantha Tan, Wenbing Yang, Meihua Shen, Richard Janek, Jeffrey Marks +1 more | 2016-02-09 |
| 9245761 | Internal plasma grid for semiconductor fabrication | Harmeet Singh, Vahid Vahedi, Alex Paterson, Monica Titus, Gowri Kamarthy | 2016-01-26 |
| 9130158 | Method to etch non-volatile metal materials | Meihua Shen, Harmeet Singh, Samantha Tan, Jeffrey Marks, Richard Janek +2 more | 2015-09-08 |
| 9034199 | Ceramic article with reduced surface defect density and process for producing a ceramic article | Ren-Guan Duan, Jennifer Y. Sun, Benjamin Schwarz | 2015-05-19 |
| 9018103 | High aspect ratio etch with combination mask | Joydeep Guha, Sirish Reddy, Kaushik Chattopadhyay, Thomas W. Mountsier, Aaron Eppler +2 more | 2015-04-28 |