Issued Patents All Time
Showing 26–50 of 106 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10692724 | Atomic layer etching methods and apparatus | David Charles Smith, Andreas Fischer | 2020-06-23 |
| 10580628 | Differentially pumped reactive gas injector | Ivan L. Berry, III, Kenneth R. Reynolds | 2020-03-03 |
| 10559475 | Control of directionality in atomic layer etching | Andreas Fischer, Richard Janek | 2020-02-11 |
| 10515816 | Integrating atomic scale processes: ALD (atomic layer deposition) and ALE (atomic layer etch) | Keren Jacobs Kanarik, Jeffrey Marks, Harmeet Singh, Samantha Tan, Alexander Kabansky +3 more | 2019-12-24 |
| 10497544 | Component of a plasma processing apparatus having a protective in situ formed layer on a plasma exposed surface | Harmeet Singh | 2019-12-03 |
| 10483085 | Use of ion beam etching to generate gate-all-around structure | Ivan L. Berry, III | 2019-11-19 |
| 10424461 | Controlling ion energy within a plasma chamber | Harmeet Singh, Alex Paterson, Gowri Kamarthy | 2019-09-24 |
| 10403476 | Active showerhead | Mariusch Gregor, David Trussell | 2019-09-03 |
| 10374144 | Dry plasma etch method to pattern MRAM stack | Samantha Tan, Taeseung Kim, Wenbing Yang, Jeffrey Marks | 2019-08-06 |
| 10336656 | Ceramic article with reduced surface defect density | Ren-Guan Duan, Jennifer Y. Sun, Benjamin Schwarz | 2019-07-02 |
| 10304659 | Ale smoothness: in and outside semiconductor industry | Keren Jacobs Kanarik, Samantha Tan, Meihua Shen, Yang Pan, Jeffrey Marks +1 more | 2019-05-28 |
| 10256108 | Atomic layer etching of AL2O3 using a combination of plasma and vapor treatments | Andreas Fischer, Richard Janek, John D. Boniface | 2019-04-09 |
| 10249521 | Wet-dry integrated wafer processing system | Andreas Fischer, Richard H. Gould, Michael Myslovaty, Philipp Engesser, Harald Okorn-Schmidt +1 more | 2019-04-02 |
| 10242883 | High aspect ratio etch of oxide metal oxide metal stack | Joydeep Guha, Sirish Reddy, Kaushik Chattopadhyay, Thomas W. Mountsier, Aaron Eppler +2 more | 2019-03-26 |
| 10229837 | Control of directionality in atomic layer etching | Andreas Fischer, Richard Janek | 2019-03-12 |
| 10224221 | Internal plasma grid for semiconductor fabrication | Harmeet Singh, Vahid Vahedi, Alex Paterson, Monica Titus, Gowri Kamarthy | 2019-03-05 |
| 10186426 | Integrating atomic scale processes: ALD (atomic layer deposition) and ale (atomic layer etch) | Keren Jacobs Kanarik, Jeffrey Marks, Harmeet Singh, Samantha Tan, Alexander Kabansky +3 more | 2019-01-22 |
| 10141163 | Controlling ion energy within a plasma chamber | Harmeet Singh, Alex Paterson, Gowri Kamarthy | 2018-11-27 |
| 10096487 | Atomic layer etching of tungsten and other metals | Wenbing Yang, Samantha Tan, Keren Jacobs Kanarik, Jeffrey Marks, Taeseung Kim +1 more | 2018-10-09 |
| 9984858 | ALE smoothness: in and outside semiconductor industry | Keren Jacobs Kanarik, Samantha Tan, Meihua Shen, Yang Pan, Jeffrey Marks +1 more | 2018-05-29 |
| 9953843 | Chamber for patterning non-volatile metals | Meihua Shen, Shuogang Huang, Theo Panagopoulos | 2018-04-24 |
| 9916993 | Ion injector and lens system for ion beam milling | Ivan L. Berry, III | 2018-03-13 |
| 9870899 | Cobalt etch back | Jialing Yang, Baosuo Zhou, Meihua Shen, John Hoang | 2018-01-16 |
| 9837254 | Differentially pumped reactive gas injector | Ivan L. Berry, III, Kenneth R. Reynolds | 2017-12-05 |
| 9818633 | Equipment front end module for transferring wafers and method of transferring wafers | Vahid Vahedi, Candi Kristoffersen, Andrew D. Bailey, III, Meihua Shen, Rangesh Raghavan +1 more | 2017-11-14 |