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Fee Li Lie

IBM: 158 patents #263 of 70,183Top 1%
TE Tessera: 9 patents #45 of 271Top 20%
Globalfoundries: 8 patents #444 of 4,424Top 15%
AS Adeia Semiconductor Solutions: 3 patents #3 of 57Top 6%
ET Elpis Technologies: 1 patents #31 of 121Top 30%
Samsung: 1 patents #49,284 of 75,807Top 70%
Overall (All Time): #4,626 of 4,157,543Top 1%
173
Patents All Time

Issued Patents All Time

Showing 25 most recent of 173 patents

Patent #TitleCo-InventorsDate
12417926 Circuit interconnect structure Sagarika Mukesh, Hosadurga Shobha, Devika Sarkar Grant 2025-09-16
12402403 Air gap spacer for metal gates Marc A. Bergendahl, Kangguo Cheng, Eric R. Miller, John R. Sporre, Sean Teehan 2025-08-26
12402391 Stressed material within gate cut region Huimei Zhou, Andrew M. Greene, Michael P. Belyansky, Oleg Gluschenkov, Robert R. Robison +2 more 2025-08-26
12334398 Multilayer dielectric stack for damascene top-via integration Sagarika Mukesh, Devika Sarkar Grant, Shravan Kumar Matham, Hosadurga Shobha, Gauri Karve 2025-06-17
12327798 Physical unclonable function Kangguo Cheng, Eric R. Miller, Gauri Karve, Marc A. Bergendahl, John R. Sporre 2025-06-10
12327730 Two-color self-aligned double patterning (SADP) to yield static random access memory (SRAM) and dense logic Dongbing Shao, Robert C. Wong, Yongan Xu 2025-06-10
12166110 Nanosheet channel-to-source and drain isolation Marc A. Bergendahl, Kangguo Cheng, Eric R. Miller, John R. Sporre, Sean Teehan 2024-12-10
12148699 High aspect ratio buried power rail metallization Sagarika Mukesh, Devika Sarkar Grant, Hosadurga Shobha, Thamarai S. Devarajan, Aakrati Jain 2024-11-19
RE50174 Structure and process to tuck fin tips self-aligned to gates Bruce B. Doris, Hong He, Sivananda K. Kanakasabapathy, Gauri Karve, Derrick Liu +2 more 2024-10-15
12046673 Vertical transistor and method of forming the vertical transistor Shogo Mochizuki, Junli Wang 2024-07-23
11978639 Two-color self-aligned double patterning (SADP) to yield static random access memory (SRAM) and dense logic Dongbing Shao, Robert C. Wong, Yongan Xu 2024-05-07
11947712 Secure identification of wafer and chip Richard C. Johnson, Alex Richard Hubbard, Vinay Pai, Cody J. Murray, Nikhil Jain 2024-04-02
11869936 Semiconductor device and method of forming the semiconductor device Marc A. Bergendahl, Gauri Karve, Eric R. Miller, Robert R. Robison, John R. Sporre +1 more 2024-01-09
11869937 Semiconductor device and method of forming the semiconductor device Marc A. Bergendahl, Gauri Karve, Eric R. Miller, Robert R. Robison, John R. Sporre +1 more 2024-01-09
11699591 Two-color self-aligned double patterning (SADP) to yield static random access memory (SRAM) and dense logic Dongbing Shao, Robert C. Wong, Yongan Xu 2023-07-11
11673766 Elevator analytics facilitating passenger destination prediction and resource optimization Gauri Karve, Tara Astigarraga, Eric R. Miller, Kangguo Cheng, Sean Teehan +1 more 2023-06-13
11652161 Nanosheet channel-to-source and drain isolation Marc A. Bergendahl, Kangguo Cheng, Eric R. Miller, John R. Sporre, Sean Teehan 2023-05-16
11615992 Substrate isolated VTFET devices Eric R. Miller, Marc A. Bergendahl, Kangguo Cheng, John R. Sporre, Gauri Karve 2023-03-28
11600325 Non volatile resistive memory logic device Hsueh-Chung Chen, Mary Claire Silvestre, Soon-Cheon Seo, Chi-Chun Liu, Chih-Chao Yang +2 more 2023-03-07
11569229 Stacked vertical transport field effect transistors with anchors Chen Zhang, Kangguo Cheng, Tenko Yamashita, Wenyu Xu 2023-01-31
11557589 Air gap spacer for metal gates Marc A. Bergendahl, Kangguo Cheng, Eric R. Miller, John R. Sporre, Sean Teehan 2023-01-17
11520768 Vertical transistor and method of forming the vertical transistor Shogo Mochizuki, Junli Wang 2022-12-06
11476415 Patterning magnetic tunnel junctions and the like while reducing detrimental resputtering of underlying features Kisup Chung, Michael Rizzolo 2022-10-18
11462631 Sublithography gate cut physical unclonable function Kangguo Cheng, Eric R. Miller, Gauri Karve, Marc A. Bergendahl, John R. Sporre 2022-10-04
11462512 Three-dimensional microelectronic package with embedded cooling channels Kamal K. Sikka, Kevin R. Winstel, Ravi K. Bonam, Iqbal Rashid Saraf, Dario L. Goldfarb +2 more 2022-10-04