Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334398 | Multilayer dielectric stack for damascene top-via integration | Sagarika Mukesh, Devika Sarkar Grant, Fee Li Lie, Hosadurga Shobha, Gauri Karve | 2025-06-17 |
| 11031346 | Advanced wafer security method including pattern and wafer verifications | Effendi Leobandung, Carol Boye, Fee Li Lie, Brad Austin | 2021-06-08 |