Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8314500 | Interconnections for flip-chip using lead-free solders and having improved reaction barrier layers | Luc Belanger, Stephen L. Buchwalter, Leena Paivikki Buchwalter, Jonathan H. Griffith, Donald W. Henderson +8 more | 2012-11-20 |
| 8003512 | Structure of UBM and solder bumps and methods of fabrication | Luc Belanger, Marc A. Bergendahl, Paul A. Lauro, Valerie Oberson, Da-Yuan Shih | 2011-08-23 |
| 7932169 | Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers | Luc Belanger, Stephen L. Buchwalter, Leena Paivikki Buchwalter, Jonathan H. Griffith, Donald W. Henderson +8 more | 2011-04-26 |
| 6973715 | Method of forming a multichip module having chips on two sides | Joseph M. Sullivan, Christopher L. Tessler | 2005-12-13 |
| 6896784 | Method for controlling local current to achieve uniform plating thickness | Tien-Jen Cheng, Todd M. Fowler, Anton Nenadic, Blessen Samuel, Keith Kwong Hon Wong | 2005-05-24 |
| 6890413 | Method and apparatus for controlling local current to achieve uniform plating thickness | Tien-Jen Cheng, Todd M. Fowler, Anton Nenadic, Blessen Samuel, Keith Kwong Hon Wong | 2005-05-10 |
| 6765152 | Multichip module having chips on two sides | Joseph M. Sullivan, Christopher L. Tessler | 2004-07-20 |
| 6678949 | Process for forming a multi-level thin-film electronic packaging structure | Chandrika Prasad, Roy Yu, Richard L. Canull, Giulio DiGiacomo, Lewis S. Goldmann +6 more | 2004-01-20 |
| 6451155 | Method using a thin adhesion promoting layer for bonding silicone elastomeric material to nickel and use thereof in making a heat sink assembly | Hilton T. Toy, David L. Edwards, Da-Yuan Shih | 2002-09-17 |
| 6291272 | Structure and process for making substrate packages for high frequency application | John U. Knickerbocker, David C. Long, Subhash L. Shinde, Lisa M. Studzinski, Rao V. Vallabhaneni | 2001-09-18 |
| 6281452 | Multi-level thin-film electronic packaging structure and related method | Chandrika Prasad, Roy Yu, Richard L. Canull, Giulio DiGiacomo, Lewis S. Goldmann +6 more | 2001-08-28 |
| 6261467 | Direct deposit thin film single/multi chip module | Sundar M. Kamath, Daniel O'Connor, Rajesh B. Patel, Herbert I. Stoller, Lisa M. Studzinski +1 more | 2001-07-17 |
| 6235412 | Corrosion-resistant terminal metal pads for thin film packages | Tien-Jen Cheng, Ashwani K. Malhotra, John R. Pennacchia, Eric D. Perfecto, Roy Yu | 2001-05-22 |
| 6083375 | Process for producing corrosion-resistant terminal metal pads for thin film packages | Tien-Jen Cheng, Ashwani K. Malhotra, John R. Pennacchia, Eric D. Perfecto, Roy Yu | 2000-07-04 |
| 6037044 | Direct deposit thin film single/multi chip module | Sundar M. Kamath, Daniel O'Connor, Rajesh B. Patel, Herbert I. Stoller, Lisa M. Studzinski +1 more | 2000-03-14 |
| 5931222 | Adhesion promoting layer for bonding polymeric adhesive to metal and a heat sink assembly using same | Hilton T. Toy, David L. Edwards, Da-Yuan Shih | 1999-08-03 |
| 5912044 | Method for forming thin film capacitors | Mukta S. Farooq, Rajesh S. Patel | 1999-06-15 |
| 5370974 | Laser exposure of photosensitive polyimide for pattern formation | Peter A. Agostino, John R. Lankard, Sr., Ron McDonald | 1994-12-06 |
| 5277725 | Process for fabricating a low dielectric composite substrate | John Acocella, Peter A. Agostino, Arnold I. Baise, Richard A. Bates, Ray M. Bryant +21 more | 1994-01-11 |
| 5270151 | Spin on oxygen reactive ion etch barrier | Peter A. Agostino, Hiroyuki Hiraoka, Carlton G. Willson, Daniel J. Dawson | 1993-12-14 |
| 5135595 | Process for fabricating a low dielectric composite substrate | John Acocella, Peter A. Agostino, Arnold I. Baise, Richard A. Bates, Ray M. Bryant +21 more | 1992-08-04 |