Issued Patents All Time
Showing 51–75 of 82 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8003319 | Systems and methods for controlling position of charged polymer inside nanopore | Stanislav Polonsky, Gustavo A. Stolovitzky | 2011-08-23 |
| 7998842 | Atomic layer deposition metallic contacts, gates and diffusion barriers | Cyril Cabral, Jr., Hyungjun Kim | 2011-08-16 |
| 7960808 | Reprogrammable fuse structure and method | Geoffrey Burr, Chandrasekharan Kothandaraman, Chung H. Lam, Xiao Hu Liu, Christy S. Tyberg +1 more | 2011-06-14 |
| 7956463 | Large grain size conductive structure for narrow interconnect openings | Chih-Chao Yang, Daniel C. Edelstein, Takeshi Nogami | 2011-06-07 |
| 7951708 | Copper interconnect structure with amorphous tantalum iridium diffusion barrier | Patrick W. DeHaven, Daniel C. Edelstein, Philip L. Flaitz, Takeshi Nogami, Chih-Chao Yang | 2011-05-31 |
| 7901980 | Self-aligned in-contact phase change memory device | Roger W. Cheek, Chung H. Lam, Alejandro G. Schrott | 2011-03-08 |
| 7851357 | Method of forming electrodeposited contacts | Cyril Cabral, Jr., Lili Deligianni, Randolph F. Knarr, Sandra G. Malhotra, Xiaoyan Shao +2 more | 2010-12-14 |
| 7749898 | Silicide interconnect structure | Paul R. Besser, Christian Lavoie, Cyril Cabral, Jr., Kenneth P. Rodbell | 2010-07-06 |
| 7514705 | Phase change memory cell with limited switchable volume | Matthew J. Breitwisch, Chung H. Lam, Jan Boris Philipp, Alejandro G. Schrott | 2009-04-07 |
| 7488967 | Structure for confining the switching current in phase memory (PCM) cells | Geoffrey Burr, Chung H. Lam, Simone Raoux, Alejandro G. Schrott, Jonathan Zanhung Sun +1 more | 2009-02-10 |
| 7405153 | Method for direct electroplating of copper onto a non-copper plateable layer | Sandra G. Malhotra, Hariklia Deligianni, Xiaoyan Shao, Tsong-Lin Tai, Oscar van der Straten | 2008-07-29 |
| 7405154 | Structure and method of forming electrodeposited contacts | Cyril Cabral, Jr., Hariklia Deligianni, Randolph F. Knarr, Sandra G. Malhotra, Xiaoyan Shao +2 more | 2008-07-29 |
| 7388273 | Reprogrammable fuse structure and method | Geoffrey Burr, Chandrasekharan Kothandaraman, Chung H. Lam, Xiao Hu Liu, Christy S. Tyberg +1 more | 2008-06-17 |
| 7378338 | Method of forming an interconnect structure diffusion barrier with high nitrogen content | Cyril Cabral, Jr., Steffen K. Kaldor, Hyungjun Kim | 2008-05-27 |
| 7247946 | On-chip Cu interconnection using 1 to 5 nm thick metal cap | John Bruley, Roy A. Carruthers, Lynne M. Gignac, Chao-Kun Hu, Eric G. Liniger +1 more | 2007-07-24 |
| 7211507 | PE-ALD of TaN diffusion barrier region on low-k materials | Derren N. Dunn, Hyungjun Kim, Soon-Cheon Seo | 2007-05-01 |
| 7186446 | Plasma enhanced ALD of tantalum nitride and bilayer | Hyungjun Kim, Andrew J. Kellock | 2007-03-06 |
| 7098537 | Interconnect structure diffusion barrier with high nitrogen content | Cyril Cabral, Jr., Steffen K. Kaldor, Hyungjun Kim | 2006-08-29 |
| 7074719 | ALD deposition of ruthenium | Hyungiun Kim | 2006-07-11 |
| 7001835 | Crystallographic modification of hard mask properties | Lawrence A. Clevenger, Andrew P. Cowley, Timothy J. Dalton, Mark Hoinkis, Steffen K. Kaldor +3 more | 2006-02-21 |
| 6943097 | Atomic layer deposition of metallic contacts, gates and diffusion barriers | Cyril Cabral, Jr., Hyungjun Kim | 2005-09-13 |
| 6380075 | Method for forming an open-bottom liner for a conductor in an electronic structure and device formed | Cyril Cabral, Jr., Chao-Kun Hu, Sandra G. Malhotra, Fenton R. McFeely, Andrew H. Simon | 2002-04-30 |
| 6342132 | Method of controlling gas density in an ionized physical vapor deposition apparatus | — | 2002-01-29 |
| 6238532 | Radio-frequency coil for use in an ionized physical vapor deposition apparatus | Darryl D. Restaino, Andrew H. Simon, Pavel Smetana | 2001-05-29 |
| 6210545 | Method for forming a perovskite thin film using a sputtering method with a fully oxidized perovskite target | Mukta S. Farooq, Robert A. Rita | 2001-04-03 |