DD

David M. Dobuzinsky

IBM: 51 patents #1,671 of 70,183Top 3%
SA Siemens Aktiengesellschaft: 6 patents #2,149 of 22,248Top 10%
Infineon Technologies Ag: 5 patents #1,696 of 7,486Top 25%
KT Kabushiki Kaisha Toshiba: 3 patents #8,011 of 21,451Top 40%
📍 South Burlington, VT: #35 of 1,136 inventorsTop 4%
🗺 Vermont: #116 of 4,968 inventorsTop 3%
Overall (All Time): #46,277 of 4,157,543Top 2%
55
Patents All Time

Issued Patents All Time

Showing 26–50 of 55 patents

Patent #TitleCo-InventorsDate
6518151 Dual layer hard mask for eDRAM gate etch process Babar A. Khan, Joyce C. Liu, Paul Wensley, Chienfan Yu 2003-02-11
6208008 Integrated circuits having reduced stress in metallization Kenneth C. Arndt, Richard A. Conti, Laertis Economikos, Jeffrey P. Gambino, Peter D. Hoh +1 more 2001-03-27
6207353 Resist formulation which minimizes blistering during etching Michael D. Armacost, Willard E. Conley, Tina J. Cotler-Wagner, Ronald A. DellaGuardia, Michael L. Passow +1 more 2001-03-27
6153474 Method of controllably forming a LOCOS oxide layer over a portion of a vertically extending sidewall of a trench extending into a semiconductor substrate Herbert L. Ho, Radhika Srinivasan, Scott D. Halle, Erwin Hammerl, Jack A. Mandelman +1 more 2000-11-28
6093281 Baffle plate design for decreasing conductance lost during precipitation of polymer precursors in plasma etching chambers Richard Wise, William C. Wille 2000-07-25
6066570 Method and apparatus for preventing formation of black silicon on edges of wafers Dung-Ching Perng, Ting Wang, Klaus Roithner 2000-05-23
6046487 Shallow trench isolation with oxide-nitride/oxynitride liner John Benedict, Philip L. Flaitz, Erwin Hammerl, Herbert L. Ho, James F. Moseman +3 more 2000-04-04
6014310 High dielectric TiO.sub.2 -SiN composite films for memory applications Gary B. Bronner, Stephan A. Cohen, Jeffrey P. Gambino, Herbert L. Ho, Karen P. Madden 2000-01-11
5998100 Fabrication process using a multi-layer antireflective layer Tsukasa Azuma, Tokuhisa Ohiwa, Tetsuo Matsuda, Katsuya Okumura 1999-12-07
5939335 Method for reducing stress in the metallization of an integrated circuit Kenneth C. Arndt, Richard A. Conti, Laertis Economikos, Jeffrey P. Gambino, Peter D. Hoh +1 more 1999-08-17
5899724 Method for fabricating a titanium resistor Stephen G. Fugardi, Erwin Hammerl, Herbert L. Ho, Samuel C. Ramac, Alvin W. Strong 1999-05-04
5885899 Method of chemically mechanically polishing an electronic component using a non-selective ammonium hydroxide slurry Michael D. Armacost, Jeffery P. GAMBINO, Mark A. Jaso 1999-03-23
5876788 High dielectric TiO.sub.2 -SiN composite films for memory applications Gary B. Bronner, Stephan A. Cohen, Jeffrey P. Gambino, Herbert L. Ho, Karen P. Madden 1999-03-02
5763315 Shallow trench isolation with oxide-nitride/oxynitride liner John Benedict, Philip L. Flaitz, Erwin Hammerl, Herbert L. Ho, James F. Moseman +3 more 1998-06-09
5759746 Fabrication process using a thin resist Tsukasa Azuma, Tokuhisa Ohiwa, Tetsuo Matsuda, Katsuya Okumura 1998-06-02
5747866 Application of thin crystalline Si.sub.3 N.sub.4 liners in shallow trench isolation (STI) structures Herbert L. Ho, Erwin Hammerl, Herbert Palm, Stephen G. Fugardi, Atul Ajmera +2 more 1998-05-05
5656535 Storage node process for deep trench-based DRAM Herbert L. Ho, Radhika Srinivasan, Scott D. Halle, Erwin Hammerl, Jack A. Mandelman +1 more 1997-08-12
5643823 Application of thin crystalline Si.sub.3 N.sub.4 liners in shallow trench isolation (STI) structures Herbert L. Ho, Erwin Hammerl, J. Herbert Palm, Stephen G. Fugardi, Atul Ajmera +2 more 1997-07-01
5622596 High density selective SiO.sub.2 :Si.sub.3 N.sub.4 etching using a stoichiometrically altered nitride etch stop Michael D. Armacost, Jeffrey P. Gambino, Son V. Nguyen 1997-04-22
5563105 PECVD method of depositing fluorine doped oxide using a fluorine precursor containing a glass-forming element Tetsuo Matsuda, Son V. Nguyen, James G. Ryan, Michael J. Shapiro 1996-10-08
5539154 Fluorinated silicon nitride films Son V. Nguyen, Douglas J. Dopp, David L. Harmon 1996-07-23
5536360 Method for etching boron nitride Son V. Nguyen 1996-07-16
5468687 Method of making TA.sub.2 O.sub.5 thin film by low temperature ozone plasma annealing (oxidation) Dan Carl, Son V. Nguyen, Tue Nguyen 1995-11-21
5462812 Fluorinated silicon nitride films Son V. Nguyen, Douglas J. Dopp, David L. Harmon 1995-10-31
5455204 Thin capacitor dielectric by rapid thermal processing Son V. Nguyen, Tue Nguyen 1995-10-03