Issued Patents All Time
Showing 26–50 of 53 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9728400 | Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium | Takeo Hanashima | 2017-08-08 |
| 9728409 | Method of manufacturing semiconductor device | Kazuhiro Harada, Kimihiko NAKATANI | 2017-08-08 |
| 9698050 | Method of manufacturing semiconductor device | Naofumi Ohashi, Tsuyoshi Takeda, Toshiyuki Kikuchi | 2017-07-04 |
| 9673043 | Method of manufacturing semiconductor device, substrate processing apparatus, substrate processing system and recording medium | Takaaki Noda, Shingo NOHARA, Satoshi Shimamoto, Takeo Hanashima, Yoshiro Hirose +1 more | 2017-06-06 |
| 9659767 | Substrate processing apparatus and method of manufacturing semiconductor device | Hidehiro Yanai, Atsushi Sano, Tadashi Takasaki | 2017-05-23 |
| 9587313 | Substrate processing apparatus, method of manufacturing semiconductor device, and non-transitory computer-readable recording medium | Yuichi Wada, Hideto Tateno, Harunobu Sakuma | 2017-03-07 |
| 9558937 | Method of manufacturing semiconductor device, substrate processing apparatus, and non-transitory computer-readable recording medium | Kimihiko NAKATANI, Kazuhiro Harada, Ryuji Yamamoto | 2017-01-31 |
| 9536734 | Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium | Takeo Hanashima | 2017-01-03 |
| 9508546 | Method of manufacturing semiconductor device | Kazuyuki Toyoda, Tadashi Takasaki, Atsushi Sano, Naonori Akae, Hidehiro Yanai | 2016-11-29 |
| 9418855 | Method of manufacturing semiconductor device, substrate processing apparatus, and non-transitory computer-readable recording medium | Kimihiko NAKATANI, Kazuhiro Harada | 2016-08-16 |
| 9368358 | Method of manufacturing a semiconductor device | Kazuhiro Harada, Arito OGAWA, Motomu DEGAI, Masahito Kitamura | 2016-06-14 |
| 9349586 | Method of manufacturing semiconductor device, substrate processing apparatus, substrate processing system and non-transitory computer-readable recording medium | Satoshi Shimamoto, Takaaki Noda, Takeo Hanashima, Yoshiro Hirose, Tsukasa Kamakura +1 more | 2016-05-24 |
| 9190281 | Method of manufacturing semiconductor device | Kazuhiro Harada, Arito OGAWA | 2015-11-17 |
| 9190299 | Apparatus for manufacturing semiconductor device, method of manufacturing semiconductor device, and recording medium | Yuichi Wada, Harunobu Sakuma, Hideto Tateno | 2015-11-17 |
| 9187826 | Method of manufacturing semiconductor device, substrate processing apparatus, and non-transitory computer-readable recording medium | Kimihiko NAKATANI, Kazuhiro Harada, Ryuji Yamamoto | 2015-11-17 |
| 9082797 | Substrate processing apparatus and method of manufacturing semiconductor device | Yukinori Aburatani, Toshiya Shimada, Kenji Shinozaki, Tomihiro Amano, Hidehiro Yanai +2 more | 2015-07-14 |
| 9059089 | Method of manufacturing semiconductor device | Kazuhiro Harada, Arito OGAWA | 2015-06-16 |
| 8986450 | Substrate processing apparatus and method of manufacturing semiconductor device | Hidehiro Yanai, Atsushi Sano, Tadashi Takasaki | 2015-03-24 |
| 8925562 | Substrate processing apparatus and method of manufacturing semiconductor device | Kazuyuki Toyoda, Tadashi Takasaki, Atsushi Sano, Naonori Akae, Hidehiro Yanai | 2015-01-06 |
| 7981761 | Method of manufacturing semiconductor device having MIM capacitor | Toshinori Imai, Tsuyoshi Fujiwara, Akira Ootaguro, Yoshihiro Kawasaki | 2011-07-19 |
| 7777346 | Semiconductor integrated circuit device and a method of manufacturing the same | Kensuke Ishikawa, Tatsuyuki Saito, Masanori Miyauchi, Toshio Saito | 2010-08-17 |
| 7569476 | Semiconductor integrated circuit device and a method of manufacturing the same | Kensuke Ishikawa, Tatsuyuki Saito, Masanori Miyauchi, Toshio Saito | 2009-08-04 |
| 7095120 | Semiconductor integrated circuit device with a connective portion for multilevel interconnection | Kensuke Ishikawa, Tatsuyuki Saito, Masanori Miyauchi, Toshio Saito | 2006-08-22 |
| 7088001 | Semiconductor integrated circuit device with a metallization structure | Tatsuyuki Saito, Uitsu Tanaka, Hidenori Suzuki, Hideaki Tsugane, Yasuko Yoshida +1 more | 2006-08-08 |
| 7018919 | Method of manufacturing a semiconductor integrated circuit device including a hole formed in an insulating film and a first conductive film formed over a bottom region and sidewalls of the hole | Kensuke Ishikawa, Tatsuyuki Saito, Masanori Miyauchi, Toshio Saito | 2006-03-28 |