Issued Patents All Time
Showing 26–49 of 49 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9624577 | Deposition of metal doped amorphous carbon film | Pramit Manna, Abhijit Basu Mallick, Rui Cheng | 2017-04-18 |
| 9613908 | Ultra-thin dielectric diffusion barrier and etch stop layer for advanced interconnect applications | Deenesh Padhi, Yihong Chen, Kelvin Chan, Abhijit Basu Mallick, Alexandros T. Demos | 2017-04-04 |
| 9412581 | Low-K dielectric gapfill by flowable deposition | Kiran V. Thadani, Jingmei Liang, Young S. Lee | 2016-08-09 |
| 9412613 | Development of high etch selective hardmask material by ion implantation into amorphous carbon films | Pramit Manna, Abhijit Basu Mallick, Ludovic Godet, Yongmei Chen, Jun Xue +2 more | 2016-08-09 |
| 9406509 | Deposition of heteroatom-doped carbon films | Pramit Manna, Abhijit Basu Mallick | 2016-08-02 |
| 9111729 | Small plasma chamber systems and methods | Richard A. Gottscho, Rajinder Dhindsa | 2015-08-18 |
| 8911590 | Integrated capacitive and inductive power sources for a plasma etching chamber | Rajinder Dhindsa, Kenji Takeshita, Alexei Marakhtanov, Andreas Fischer | 2014-12-16 |
| 8622021 | High lifetime consumable silicon nitride-silicon dioxide plasma processing components | Travis R. Taylor, Bobby Kadkhodayan, K. Y. Ramanujam, Biljana Mikijelj, Shanghua Wu | 2014-01-07 |
| 8576866 | Hierarchical rate limiting of control packets | Anubhav Gupta, Arunkumar M. Desigan, Arun Sharma | 2013-11-05 |
| 8337713 | Methods for RF pulsing of a narrow gap capacitively coupled reactor | Peter Loewenhardt, Andreas Fischer | 2012-12-25 |
| 8097120 | Process tuning gas injection from the substrate edge | Rajinder Dhindsa | 2012-01-17 |
| 7976673 | RF pulsing of a narrow gap capacitively coupled reactor | Peter Loewenhardt, Andreas Fischer | 2011-07-12 |
| 7749353 | High aspect ratio etch using modulation of RF powers of various frequencies | Camelia Rusu, Rajinder Dhindsa, Eric A. Hudson, Lumin Li, Felix Kozakevich | 2010-07-06 |
| 7645707 | Etch profile control | Camelia Rusu, Zhisong Huang, Eric A. Hudson, Aaron Eppler | 2010-01-12 |
| 7547635 | Process for etching dielectric films with improved resist and/or etch profile characteristics | Aaron Eppler, Robert Chebi | 2009-06-16 |
| 7405521 | Multiple frequency plasma processor method and apparatus | Raj Dhindsa, S. M. Reza Sadjadi, Felix Kozakevich, Dave Trussell, Lumin Li +5 more | 2008-07-29 |
| 7144521 | High aspect ratio etch using modulation of RF powers of various frequencies | Camelia Rusu, Rajinder Dhindsa, Eric A. Hudson, Lumin Li, Felix Kozakevich | 2006-12-05 |
| 7094315 | Chamber configuration for confining a plasma | Jian J. Chen, Eric H. Lenz | 2006-08-22 |
| 6984288 | Plasma processor in plasma confinement region within a vacuum chamber | Rajinder Dhindsa, Eric H. Lenz, Lumin Li | 2006-01-10 |
| 6942816 | Methods of reducing photoresist distortion while etching in a plasma processing system | Camelia Rusu | 2005-09-13 |
| 6872281 | Chamber configuration for confining a plasma | Jian J. Chen, Eric H. Lenz | 2005-03-29 |
| 6824627 | Stepped upper electrode for plasma processing uniformity | Rajinder Dhindsa, Aaron Eppler, Eric H. Lenz | 2004-11-30 |
| 6714033 | Probe for direct wafer potential measurements | Konstantin Makhratchev | 2004-03-30 |
| 6391787 | Stepped upper electrode for plasma processing uniformity | Rajinder Dhindsa, Aaron Eppler, Eric H. Lenz | 2002-05-21 |