| 10037883 |
Enhanced productivity for an etch system through polymer management |
Alfredo Granados, Zhao H. Ceng, Jianqi Wang, Rajan Balesan |
2018-07-31 |
| 9865472 |
Fabrication of a silicon structure and deep silicon etch with profile control |
Frank Y. Lin, Jaroslaw W. Winniczek, Wan-Lin Chen, Erin Moore, Lily Zheng +3 more |
2018-01-09 |
| 9857307 |
Elevated surface enhanced Raman spectroscopy resonator structures and method of making same |
Fanqing Frank Chen |
2018-01-02 |
| 9719931 |
Surface enhanced raman spectroscopy resonator structures and methods of making same |
Fanqing Frank Chen |
2017-08-01 |
| 9673069 |
High frequency filter for improved RF bias signal stability |
Yuri Trachuk, Carl W. Almgren |
2017-06-06 |
| 9330926 |
Fabrication of a silicon structure and deep silicon etch with profile control |
Frank Y. Lin, Jaroslaw W. Winniczek, Wan-Lin Chen, Erin McDonnell, Lily Zheng +3 more |
2016-05-03 |
| 9318341 |
Methods for etching a substrate |
Alan Cheshire, Gabriel Roupillard, Alfredo Granados |
2016-04-19 |
| 9018098 |
Silicon etch with passivation using chemical vapor deposition |
Jaroslaw W. Winniczek |
2015-04-28 |
| 8757178 |
Method and apparatus for removing photoresist |
Jaroslaw W. Winniczek |
2014-06-24 |
| 8598037 |
Silicon etch with passivation using plasma enhanced oxidation |
Jaroslaw W. Winniczek |
2013-12-03 |
| 8425682 |
High strip rate downstream chamber |
Ing-Yann Albert Wang, Jaroslaw W. Winniczek, David Cooperberg, Erik A. Edelberg |
2013-04-23 |
| 8298336 |
High strip rate downstream chamber |
Ing-Yann Albert Wang, Jaroslaw W. Winniczek, David Cooperberg, Erik A. Edelberg |
2012-10-30 |
| 8173547 |
Silicon etch with passivation using plasma enhanced oxidation |
Jaroslaw W. Winniczek |
2012-05-08 |
| 8043434 |
Method and apparatus for removing photoresist |
Jaroslaw W. Winniczek |
2011-10-25 |
| 7824519 |
Variable volume plasma processing chamber and associated methods |
Ing-Yann Albert Wang |
2010-11-02 |
| 7605063 |
Photoresist stripping chamber and methods of etching photoresist on substrates |
Jaroslaw W. Winniczek, Alan J. Miller, Gladys Lo |
2009-10-20 |
| 7547635 |
Process for etching dielectric films with improved resist and/or etch profile characteristics |
Aaron Eppler, Mukund Srinivasan |
2009-06-16 |
| 7476291 |
High chamber temperature process and chamber design for photo-resist stripping and post-metal etch passivation |
Ing-Yann Albert Wang |
2009-01-13 |
| 7083903 |
Methods of etching photoresist on substrates |
Erik A. Edelberg, Gladys Lo |
2006-08-01 |
| 6759336 |
Methods for reducing contamination of semiconductor substrates |
David Hemker |
2004-07-06 |
| 6528427 |
Methods for reducing contamination of semiconductor substrates |
David Hemker |
2003-03-04 |
| 6241845 |
Apparatus for reducing process drift in inductive coupled plasma etching such as oxide layer |
Prashant Gadgil, Janet M. Flanner, John P. Jordan, Adrian Doe |
2001-06-05 |
| 6048798 |
Apparatus for reducing process drift in inductive coupled plasma etching such as oxide layer |
Prashant Gadgil, Janet M. Flanner, John P. Jordon, Adrian Doe |
2000-04-11 |
| 5451543 |
Straight sidewall profile contact opening to underlying interconnect and method for making the same |
Michael P. Woo, James D. Hayden |
1995-09-19 |
| 5279865 |
High throughput interlevel dielectric gap filling process |
Sanjiv Mittal |
1994-01-18 |
