Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10037883 | Enhanced productivity for an etch system through polymer management | Alfredo Granados, Zhao H. Ceng, Jianqi Wang, Rajan Balesan | 2018-07-31 |
| 9865472 | Fabrication of a silicon structure and deep silicon etch with profile control | Frank Y. Lin, Jaroslaw W. Winniczek, Wan-Lin Chen, Erin Moore, Lily Zheng +3 more | 2018-01-09 |
| 9857307 | Elevated surface enhanced Raman spectroscopy resonator structures and method of making same | Fanqing Frank Chen | 2018-01-02 |
| 9719931 | Surface enhanced raman spectroscopy resonator structures and methods of making same | Fanqing Frank Chen | 2017-08-01 |
| 9673069 | High frequency filter for improved RF bias signal stability | Yuri Trachuk, Carl W. Almgren | 2017-06-06 |
| 9330926 | Fabrication of a silicon structure and deep silicon etch with profile control | Frank Y. Lin, Jaroslaw W. Winniczek, Wan-Lin Chen, Erin McDonnell, Lily Zheng +3 more | 2016-05-03 |
| 9318341 | Methods for etching a substrate | Alan Cheshire, Gabriel Roupillard, Alfredo Granados | 2016-04-19 |
| 9018098 | Silicon etch with passivation using chemical vapor deposition | Jaroslaw W. Winniczek | 2015-04-28 |
| 8757178 | Method and apparatus for removing photoresist | Jaroslaw W. Winniczek | 2014-06-24 |
| 8598037 | Silicon etch with passivation using plasma enhanced oxidation | Jaroslaw W. Winniczek | 2013-12-03 |
| 8425682 | High strip rate downstream chamber | Ing-Yann Albert Wang, Jaroslaw W. Winniczek, David Cooperberg, Erik A. Edelberg | 2013-04-23 |
| 8298336 | High strip rate downstream chamber | Ing-Yann Albert Wang, Jaroslaw W. Winniczek, David Cooperberg, Erik A. Edelberg | 2012-10-30 |
| 8173547 | Silicon etch with passivation using plasma enhanced oxidation | Jaroslaw W. Winniczek | 2012-05-08 |
| 8043434 | Method and apparatus for removing photoresist | Jaroslaw W. Winniczek | 2011-10-25 |
| 7824519 | Variable volume plasma processing chamber and associated methods | Ing-Yann Albert Wang | 2010-11-02 |
| 7605063 | Photoresist stripping chamber and methods of etching photoresist on substrates | Jaroslaw W. Winniczek, Alan J. Miller, Gladys Lo | 2009-10-20 |
| 7547635 | Process for etching dielectric films with improved resist and/or etch profile characteristics | Aaron Eppler, Mukund Srinivasan | 2009-06-16 |
| 7476291 | High chamber temperature process and chamber design for photo-resist stripping and post-metal etch passivation | Ing-Yann Albert Wang | 2009-01-13 |
| 7083903 | Methods of etching photoresist on substrates | Erik A. Edelberg, Gladys Lo | 2006-08-01 |
| 6759336 | Methods for reducing contamination of semiconductor substrates | David Hemker | 2004-07-06 |
| 6528427 | Methods for reducing contamination of semiconductor substrates | David Hemker | 2003-03-04 |
| 6241845 | Apparatus for reducing process drift in inductive coupled plasma etching such as oxide layer | Prashant Gadgil, Janet M. Flanner, John P. Jordan, Adrian Doe | 2001-06-05 |
| 6048798 | Apparatus for reducing process drift in inductive coupled plasma etching such as oxide layer | Prashant Gadgil, Janet M. Flanner, John P. Jordon, Adrian Doe | 2000-04-11 |
| 5451543 | Straight sidewall profile contact opening to underlying interconnect and method for making the same | Michael P. Woo, James D. Hayden | 1995-09-19 |
| 5279865 | High throughput interlevel dielectric gap filling process | Sanjiv Mittal | 1994-01-18 |