| 6946303 |
Electronically diagnosing a component in a process line using a substrate signature |
James C. Vetter |
2005-09-20 |
| 6890774 |
System and method for creating a substrate signature |
James C. Vetter |
2005-05-10 |
| 6696366 |
Technique for etching a low capacitance dielectric layer |
Ian J. Morey, Susan Ellingboe, Christine Janowiak, John Lang |
2004-02-24 |
| 6653734 |
Convertible hot edge ring to improve low-K dielectric etch |
Susan Ellingboe, Christine Janowiak, John Lang, Ian J. Morey |
2003-11-25 |
| 6426304 |
Post etch photoresist strip with hydrogen for organosilicate glass low-&kgr; etch applications |
Ting-An Chien, Ian J. Morey |
2002-07-30 |
| 6410437 |
Method for etching dual damascene structures in organosilicate glass |
Ian J. Morey |
2002-06-25 |
| 6383931 |
Convertible hot edge ring to improve low-K dielectric etch |
Susan Ellingboe, Christine Janowiak, John Lang, Ian J. Morey |
2002-05-07 |
| 6241845 |
Apparatus for reducing process drift in inductive coupled plasma etching such as oxide layer |
Prashant Gadgil, John P. Jordan, Adrian Doe, Robert Chebi |
2001-06-05 |
| 6165910 |
Self-aligned contacts for semiconductor device |
Linda Marquez, Joel M. Cook, Ian J. Morey |
2000-12-26 |
| 6133153 |
Self-aligned contacts for semiconductor device |
Linda Marquez |
2000-10-17 |
| 6114250 |
Techniques for etching a low capacitance dielectric layer on a substrate |
Susan Ellingboe, Ian J. Morey |
2000-09-05 |
| 6048798 |
Apparatus for reducing process drift in inductive coupled plasma etching such as oxide layer |
Prashant Gadgil, John P. Jordon, Adrian Doe, Robert Chebi |
2000-04-11 |
| 5783496 |
Methods and apparatus for etching self-aligned contacts |
Prashant Gadgil, Linda Marquez, Adrian Doe, Joel M. Cook |
1998-07-21 |
| 5021358 |
Semiconductor fabrication process using sacrificial oxidation to reduce tunnel formation during tungsten deposition |
Michelangelo Delfino |
1991-06-04 |
| 4987099 |
Method for selectively filling contacts or vias or various depths with CVD tungsten |
— |
1991-01-22 |
| 4822749 |
Self-aligned metallization for semiconductor device and process using selectively deposited tungsten |
Paulus Z. A. Van Der Putte |
1989-04-18 |