Issued Patents All Time
Showing 26–50 of 68 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9773692 | In-situ removable electrostatic chuck | Lara Hawrylchak, Steven V. Sansoni | 2017-09-26 |
| 9754771 | Encapsulated magnetron | Brian T. West, Roger M. Johnson | 2017-09-05 |
| 9735037 | Locally heated multi-zone substrate support | — | 2017-08-15 |
| 9721820 | End effector for transferring a substrate | Michel A. Rosa | 2017-08-01 |
| 9711386 | Electrostatic chuck for high temperature process applications | Zheng Yuan | 2017-07-18 |
| 9649592 | Plasma abatement of compounds containing heavy atoms | Monique McIntosh, Colin John Dickinson, Paul Fisher, Yutaka Tanaka, Zheng Yuan | 2017-05-16 |
| 9580796 | Deposition apparatus and methods to reduce deposition asymmetry | Alan A. Ritchie | 2017-02-28 |
| 9552967 | Abatement system having a plasma source | Rongping Wang, Brian T. West, Roger M. Johnson, Colin John Dickinson | 2017-01-24 |
| 9543124 | Capacitively coupled plasma source for abating compounds produced in semiconductor processes | Rongping Wang, Brian T. West, Roger M. Johnson, Colin John Dickinson | 2017-01-10 |
| 9536768 | Electrostatic carrier for thin substrate handling | — | 2017-01-03 |
| 9508584 | In-situ removable electrostatic chuck | Lara Hawrylchak, Steven V. Sansoni | 2016-11-29 |
| 9472434 | Locally heated multi-zone substrate support | — | 2016-10-18 |
| 9460950 | Wafer carrier for smaller wafers and wafer pieces | Cheryl Knepfler | 2016-10-04 |
| 9240308 | Hall effect enhanced capacitively coupled plasma source, an abatement system, and vacuum processing system | Rongping Wang, Brian T. West, Roger M. Johnson, Colin John Dickinson | 2016-01-19 |
| 9230780 | Hall effect enhanced capacitively coupled plasma source | Rongping Wang, Brian T. West, Roger M. Johnson, Colin John Dickinson | 2016-01-05 |
| 8887901 | Conveyor sprocket assembly | William J. Miller | 2014-11-18 |
| 8795488 | Apparatus for physical vapor deposition having centrally fed RF energy | Muhammad M. Rasheed, Lara Hawrylchak, Donny Young, Kirankumar Neelasandra SAVANDAIAH, Alan A. Ritchie | 2014-08-05 |
| 8753989 | Method to increase tensile stress of silicon nitride films using a post PECVD deposition UV cure | Mihaela Balseanu, Li-Qun Xia, Mei-Yee Shek, Jia-Sheng Lee, Vladimir Zubkov +4 more | 2014-06-17 |
| 8486242 | Deposition apparatus and methods to reduce deposition asymmetry | — | 2013-07-16 |
| 8129290 | Method to increase tensile stress of silicon nitride films using a post PECVD deposition UV cure | Mihaela Balseanu, Li-Qun Xia, Mei-Yee Shek, Jia-Sheng Lee, Vladimir Zubkov +4 more | 2012-03-06 |
| 7718045 | Ground shield with reentrant feature | Jennifer Tiller, Anantha K. Subramani, Keith A. Miller | 2010-05-18 |
| 7588036 | Chamber clean method using remote and in situ plasma cleaning systems | Zhenjiang Cui, Canfeng Lai, Paddy Krishnaraj | 2009-09-15 |
| 7399388 | Sequential gas flow oxide deposition technique | Farhad Moghadam, Padmanabhan Krishnaraj, Thanh Pham | 2008-07-15 |
| 7399707 | In situ application of etch back for improved deposition into high-aspect-ratio features | Padmanabhan Krishnaraj, Pavel Ionov, Canfeng Lai, Shamouil Shamouilian | 2008-07-15 |
| 7363876 | Multi-core transformer plasma source | Canfeng Lai, Peter Loewenhardt, Tsutomu Tanaka, Shamouil Shamouilian | 2008-04-29 |