Issued Patents All Time
Showing 26–50 of 60 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7101253 | Load cup for chemical mechanical polishing | — | 2006-09-05 |
| 7029365 | Pad assembly for electrochemical mechanical processing | Shou-Sung Chang, Stan Tsai, Liang-Yuh Chen, Alain Duboust, Ralph Wadensweiler | 2006-04-18 |
| 7005046 | Apparatus for electro chemical deposition | Joseph Stevens, Yevgeniy Rabinovich, Sandy Chao, Mark Denome, Allen L. D'Ambra | 2006-02-28 |
| 6935466 | Lift pin alignment and operation methods and apparatus | Dmitry Lubomirsky, Sheshraj Tulshibagwale, Avi Tepman | 2005-08-30 |
| 6837978 | Deposition uniformity control for electroplating apparatus, and associated method | H. Peter W. Hey, Yezdi Dordi, Mark Denome | 2005-01-04 |
| 6824612 | Electroless plating system | Joseph Stevens, Dmitry Lubomirsky, Ian Pancham, Howard Grunes, Yeuk-Fai Edwin Mok +1 more | 2004-11-30 |
| 6802947 | Apparatus and method for electro chemical plating using backside electrical contacts | Michael Anthony Wood, Dmitry Lubomirsky | 2004-10-12 |
| 6770565 | System for planarizing metal conductive layers | Avi Tepman, Dmitry Lubomirsky, Timothy Webb | 2004-08-03 |
| 6736408 | Rotary vacuum-chuck with venturi formed at base of rotating shaft | Bernardo Donoso, Alexander Lerner | 2004-05-18 |
| 6720263 | Planarization of metal layers on a semiconductor wafer through non-contact de-plating and control with endpoint detection | Joseph Stevens, Alexander Lerner | 2004-04-13 |
| 6689418 | Apparatus for wafer rinse and clean and edge etching | Avi Tepman, Yeuk-Fai Edwin Mok, Arnold Kholodenko | 2004-02-10 |
| 6662673 | Linear motion apparatus and associated method | — | 2003-12-16 |
| 6635157 | Electro-chemical deposition system | Yezdi Dordi, Ratson Morad, Peter Hey, Mark Denome, Michael Sugarman +10 more | 2003-10-21 |
| 6612014 | Dual post centrifugal wafer clip for spin rinse dry unit | Bernardo Donoso, Joseph Stevens, Alexander Sou-Kang Ko | 2003-09-02 |
| 6585876 | Flow diffuser to be used in electro-chemical plating system and method | Yezdi Dordi, Joseph Stevens, H. Peter W. Hey | 2003-07-01 |
| 6571657 | Multiple blade robot adjustment apparatus and associated method | Avi Tepman, Timothy Joseph Franklin | 2003-06-03 |
| 6557237 | Removable modular cell for electro-chemical plating and method | — | 2003-05-06 |
| 6516815 | Edge bead removal/spin rinse dry (EBR/SRD) module | Joe Stevens, Alex Ko, Yeuk-Fai Edwin Mok | 2003-02-11 |
| 6517130 | Self positioning vacuum chuck | Bernardo Donoso, Joseph Stevens, Mark Denome | 2003-02-11 |
| 6478937 | Substrate holder system with substrate extension apparatus and associated method | Jayant Lakshmikanthan | 2002-11-12 |
| 6454927 | Apparatus and method for electro chemical deposition | Joseph Stevens, Yevgeniy Rabinovich, Sandy Chao, Mark Denome, Allen L. D'Ambra | 2002-09-24 |
| 6440261 | Dual buffer chamber cluster tool for semiconductor wafer processing | Avi Tepman, Allen L. D'Ambra | 2002-08-27 |
| 6432282 | Method and apparatus for supplying electricity uniformly to a workpiece | Shamouil Shamouilian, Anada H. Kumar, Joseph Stevens, Ricardo Leon, Jon Clinton | 2002-08-13 |
| 6369493 | Microwave plasma applicator having a thermal transfer medium between a plasma containing tube and a cooling jacket | Dmitry Lubomirsky, Harald Herchen, Simon Yavelberg, David Palagashvili | 2002-04-09 |
| 6270687 | RF plasma method | Yan Ye, Avi Tepman, Diana Xiaobing Ma, Gerald Yin, Peter Loewenhardt +2 more | 2001-08-07 |