| 11205589 |
Methods and apparatuses for forming interconnection structures |
He Ren, Hao Jiang, Mehul Naik, Ellie Yieh |
2021-12-21 |
| 11145808 |
Methods for etching a structure for MRAM applications |
Jong Mun Kim, Minrui Yu, Chando Park, Mang-Mang Ling, Jaesoo Ahn +3 more |
2021-10-12 |
| 11114333 |
Method for depositing and reflow of a high quality etch resistant gapfill dielectric film |
Ellie Yieh, Chentsau Ying |
2021-09-07 |
| 11110383 |
Gas abatement apparatus |
Adib Khan, Qiwei Liang, Sultan Malik, Rafika Smati, Joseph Ng +1 more |
2021-09-07 |
| 11114306 |
Methods for depositing dielectric material |
Bhargav S. Citla, Jethro Tannos, Jingyi Li, Douglas A. Buchberger, Jr., Zhong Qiang Hua +1 more |
2021-09-07 |
| 11112697 |
Method and apparatus for post exposure processing of photoresist wafers |
Viachslav Babayan, Douglas A. Buchberger, Jr., Qiwei Liang, Ludovic Godet, Daniel J. Woodruff +2 more |
2021-09-07 |
| 11094573 |
Method and apparatus for thin wafer carrier |
Jingyu Qiao, Qiwei Liang, Viachslav Babayan, Seshadri Ramaswami |
2021-08-17 |
| 11066747 |
Chemical delivery chamber for self-assembled monolayer processes |
Qiwei Liang, Adib Khan, Tobin Kaufman-Osborn, Ludovic Godet |
2021-07-20 |
| 11049537 |
Additive patterning of semiconductor film stacks |
John O. Dukovic, Ellie Yieh, Praburam Gopalraja, Steven Hiloong WELCH, Bhargav S. Citla |
2021-06-29 |
| 11003080 |
Process chamber for field guided exposure and method for implementing the process chamber |
Kartik Ramaswamy |
2021-05-11 |
| 10998200 |
High pressure annealing process for metal containing materials |
Kaushal K. Singh, Mei-Yee Shek, Ellie Yieh |
2021-05-04 |
| 10964527 |
Residual removal |
Jong Mun Kim, Biao Liu, Cheng Pan, Erica Chen, Chentsau Ying +1 more |
2021-03-30 |
| 10954594 |
High temperature vapor delivery system and method |
Viachslav Babayan, Qiwei Liang, Tobin Kaufman-Osborn, Ludovic Godet |
2021-03-23 |
| 10957518 |
Chamber with individually controllable plasma generation regions for a reactor for processing a workpiece |
Kartik Ramaswamy, Lawrence Wong, Steven Lane, Yang Yang, Praburam Gopalraja |
2021-03-23 |
| 10950429 |
Methods of forming amorphous carbon hard mask layers and hard mask layers formed therefrom |
Bhargav S. Citla, Mei-Yee Shek |
2021-03-16 |
| 10947621 |
Low vapor pressure chemical delivery |
Adib Khan, Qiwei Liang, Tobin Kaufman-Osborn |
2021-03-16 |
| 10943779 |
Method and system for three-dimensional (3D) structure fill |
Ellie Yieh, Ludovic Godet, Er-Xuan Ping, Gary E. Dickerson |
2021-03-09 |
| 10927449 |
Extension of PVD chamber with multiple reaction gases, high bias power, and high power impulse source for deposition, implantation, and treatment |
Jingjing Liu, Ludovic Godet, Yongmei Chen, Anantha K. Subramani |
2021-02-23 |
| 10923367 |
Process chamber for etching low K and other dielectric films |
Dmitry Lubomirsky, Ellie Yieh, Sergey G. Belostotskiy |
2021-02-16 |
| 10916426 |
Formation of crystalline, layered transition metal dichalcogenides |
Keith Tatseun Wong, Ellie Yieh |
2021-02-09 |
| 10916505 |
Graphene diffusion barrier |
Yong Wu, Srinivas Gandikota, Abhijit Basu Mallick |
2021-02-09 |
| 10916433 |
Methods of forming metal silicide layers and metal silicide layers formed therefrom |
He Ren, Maximillian Clemons, Mei-Yee Shek, Minrui Yu, Bencherki Mebarki +2 more |
2021-02-09 |
| 10892161 |
Enhanced selective deposition process |
Biao Liu, Cheng Pan, Erica Chen, Chang Ke, Lei Zhou |
2021-01-12 |
