Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11112697 | Method and apparatus for post exposure processing of photoresist wafers | Douglas A. Buchberger, Jr., Qiwei Liang, Ludovic Godet, Srinivas D. Nemani, Daniel J. Woodruff +2 more | 2021-09-07 | $49,370,000 |
| 11094573 | Method and apparatus for thin wafer carrier | Jingyu Qiao, Qiwei Liang, Seshadri Ramaswami, Srinivas D. Nemani | 2021-08-17 | $63,158,000 |
| 11049701 | Biased cover ring for a substrate processing system | Adolph Miller Allen, William Johanson, Zhong Qiang Hua, Carl Johnson, Vanessa Faune +4 more | 2021-06-29 | $47,858,000 |
| 10954594 | High temperature vapor delivery system and method | Qiwei Liang, Tobin Kaufman-Osborn, Ludovic Godet, Srinivas D. Nemani | 2021-03-23 | $48,969,000 |