Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11094573 | Method and apparatus for thin wafer carrier | Jingyu Qiao, Qiwei Liang, Viachslav Babayan, Srinivas D. Nemani | 2021-08-17 |
| 11088293 | Methods and apparatus for producing copper-indium-gallium-selenium (CIGS) film | Philip Hsin-hua Li | 2021-08-10 |
| 11018275 | Method of creating CIGS photodiode for image sensor applications | Philip Hsin-hua Li | 2021-05-25 |
| 10978334 | Sealing structure for workpiece to substrate bonding in a processing chamber | Chin Hock Toh, Tuck Foong Koh, Sriskantharajah Thirunavukarasu, Jen Sern Lew, Arvind Sundarrajan | 2021-04-13 |