Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10991617 | Methods and apparatus for cleaving of semiconductor substrates | Felix Deng, Yueh Sheng Ow, Nuno Yen-Chu Chen, Yuichi Wada, Sree Rangasai V. Kesapragada +1 more | 2021-04-27 |
| 10978334 | Sealing structure for workpiece to substrate bonding in a processing chamber | Chin Hock Toh, Sriskantharajah Thirunavukarasu, Jen Sern Lew, Arvind Sundarrajan, Seshadri Ramaswami | 2021-04-13 |