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Methods and apparatus for processing a substrate |
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Substrate carrier system utilizing electrostatic chucking to accommodate substrate size heterogeneity |
Karthik Elumalai, Jen Sern Lew, Mingwei Zhu |
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Nozzle for uniform plasma processing |
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Sealing structure for workpiece to substrate bonding in a processing chamber |
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Apparatus for handling various sized substrates |
Eng Sheng Peh, Karrthik Parathithasan, Fang Jie Lim |
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| 10903055 |
Edge ring for bevel polymer reduction |
Rohit Mishra, Graeme Scott, Khalid Mohiuddin Sirajuddin, Sheshraj L. Yulshibagwale |
2021-01-26 |