Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11111583 | Substrate carrier system utilizing electrostatic chucking to accommodate substrate size heterogeneity | Sriskantharajah Thirunavukarasu, Karthik Elumalai, Mingwei Zhu | 2021-09-07 |
| 10978334 | Sealing structure for workpiece to substrate bonding in a processing chamber | Chin Hock Toh, Tuck Foong Koh, Sriskantharajah Thirunavukarasu, Arvind Sundarrajan, Seshadri Ramaswami | 2021-04-13 |