Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177146 | Methods and apparatus for processing a substrate | Qi Jie Peng, Chin Wei Tan, Jun-Liang Su, Fang Jie Lim, Sriskantharajah Thirunavukarasu +1 more | 2021-11-16 |
| 10978334 | Sealing structure for workpiece to substrate bonding in a processing chamber | Chin Hock Toh, Tuck Foong Koh, Sriskantharajah Thirunavukarasu, Jen Sern Lew, Seshadri Ramaswami | 2021-04-13 |