Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10978334 | Sealing structure for workpiece to substrate bonding in a processing chamber | Tuck Foong Koh, Sriskantharajah Thirunavukarasu, Jen Sern Lew, Arvind Sundarrajan, Seshadri Ramaswami | 2021-04-13 |