Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10991617 | Methods and apparatus for cleaving of semiconductor substrates | Yueh Sheng Ow, Tuck Foong Koh, Nuno Yen-Chu Chen, Yuichi Wada, Sree Rangasai V. Kesapragada +1 more | 2021-04-27 |
FD
Felix Deng
Overall (2021): #458,087 of 548,734Top 85%
1
Patents 2021