Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10991617 | Methods and apparatus for cleaving of semiconductor substrates | Felix Deng, Yueh Sheng Ow, Tuck Foong Koh, Yuichi Wada, Sree Rangasai V. Kesapragada +1 more | 2021-04-27 |