Issued Patents 2020
Showing 26–50 of 80 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10747850 | Medication scheduling and alerts | Maryam Ashoori, Benjamin D. Briggs, Leigh Anne H. Clevenger, Jonathan H. Connell, II, Nalini K. Ratha +1 more | 2020-08-18 |
| 10746782 | Accelerated wafer testing using non-destructive and localized stress | Benjamin D. Briggs, Nicholas Anthony Lanzillo, Michael Rizzolo, Theodorus E. Standaert, James H. Stathis | 2020-08-18 |
| 10740938 | Cognitive situation-aware vision deficiency remediation | Yuk L. Chan, Alain Loiseau, Deepti M. Naphade | 2020-08-11 |
| 10741751 | Fully aligned semiconductor device with a skip-level via | Nicholas Anthony Lanzillo, Benjamin D. Briggs, Chih-Chao Yang, Hsueh-Chung Chen | 2020-08-11 |
| 10741449 | Stacked transistors with different channel widths | Kangguo Cheng, Balasubramanian Pranatharthiharan, John H. Zhang | 2020-08-11 |
| 10739397 | Accelerated wafer testing using non-destructive and localized stress | Benjamin D. Briggs, Nicholas Anthony Lanzillo, Michael Rizzolo, Theodorus E. Standaert, James H. Stathis | 2020-08-11 |
| 10734277 | Top via back end of the line interconnect integration | Chih-Chao Yang, Benjamin D. Briggs, Brent A. Anderson | 2020-08-04 |
| 10734579 | Protuberant contacts for resistive switching devices | Takashi Ando, Chih-Chao Yang | 2020-08-04 |
| 10734523 | Nanosheet substrate to source/drain isolation | Fee Li Lie, Mona A. Ebrish, Ekmini Anuja De Silva, Indira Seshadri, Gauri Karve +2 more | 2020-08-04 |
| 10734475 | Stacked MIM capacitors with self-aligned contact to reduce via enclosure | Takashi Ando, Robert A. Groves, Hemanth Jagannathan, Griselda Bonilla | 2020-08-04 |
| 10734289 | Method for forming strained fin channel devices | Kangguo Cheng, Junli Wang, Carl Radens, John H. Zhang | 2020-08-04 |
| 10727124 | Structure and method for forming fully-aligned trench with an up-via integration scheme | Nicholas Anthony Lanzillo, Benjamin D. Briggs | 2020-07-28 |
| 10720567 | Prevention of switching of spins in magnetic tunnel junctions by on-chip parasitic magnetic shield | Benjamin D. Briggs, Nicholas Anthony Lanzillo, Michael Rizzolo, Theodorus E. Standaert | 2020-07-21 |
| 10714389 | Structure and method using metal spacer for insertion of variable wide line implantation in SADP/SAQP integration | Hsueh-Chung Chen, James J. Kelly, Yann Mignot, Cornelius Brown Peethala | 2020-07-14 |
| 10700214 | Overturned thin film device with self-aligned gate and source/drain (S/D) contacts | Carl Radens, Yiheng Xu, John H. Zhang | 2020-06-30 |
| 10699050 | Front-end-of-line shape merging cell placement and optimization | David Wolpert, Erwin Behnen, Patrick Watson, Chih-Chao Yang, Timothy A. Schell | 2020-06-30 |
| 10699950 | Method of optimizing wire RC for device performance and reliability | Baozhen Li, Kirk D. Peterson, John E. Sheets, II, Terry A. Spooner | 2020-06-30 |
| 10681207 | Caller identity verification based on unique multi-device signatures | Richard C. Johnson, Spyridon Skordas | 2020-06-09 |
| 10679934 | Capacitance reduction in sea of lines BEOL metallization | Benjamin D. Briggs, Huai Huang, Christopher J. Penny, Michael Rizzolo, Hosadurga Shobha | 2020-06-09 |
| 10676216 | Non-intrusive unmanned entity inspection | Yuk L. Chan, Eileen P. Tedesco, Kyle E. Gilbertson, Daniel F. Hogerty, Benjamin D. Briggs | 2020-06-09 |
| 10672984 | Resistive memory crossbar array compatible with Cu metallization | Takashi Ando, Michael Rizzolo, Shyng-Tsong Chen | 2020-06-02 |
| 10658233 | Dielectric damage-free dual damascene Cu interconnects without barrier at via bottom | Koichi Motoyama, Benjamin D. Briggs, Gangadhara Raja Muthinti, Cornelius Brown Peethala | 2020-05-19 |
| 10658585 | Dedicated contacts for controlled electroforming of memory cells in resistive random-access memory array | Takashi Ando, Chih-Chao Yang, Benjamin D. Briggs | 2020-05-19 |
| 10658235 | Rework for metal interconnects using etch and thermal anneal | Prasad Bhosale, Terry A. Spooner, Chih-Chao Yang | 2020-05-19 |
| 10657677 | Cognitive situation-aware vision deficiency remediation | Yuk L. Chan, Alain Loiseau, Deepti M. Naphade | 2020-05-19 |