Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10777433 | Gas-controlled bonding platform for edge defect reduction during wafer bonding | Wei Lin, Robert R. Young | 2020-09-15 |
| 10681207 | Caller identity verification based on unique multi-device signatures | Richard C. Johnson, Lawrence A. Clevenger | 2020-06-09 |
| 10615139 | Semiconductor device including built-in crack-arresting film structure | Wei Lin, Leathen Shi, Kevin R. Winstel | 2020-04-07 |