Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10811305 | Wafer level integration including design/co-design, structure process, equipment stress management, and thermal management | Li-Wen Hung, John U. Knickerbocker, Cornelia Tsang Yang, Bucknell C. Webb | 2020-10-20 |
| 10615139 | Semiconductor device including built-in crack-arresting film structure | Wei Lin, Spyridon Skordas, Kevin R. Winstel | 2020-04-07 |