| 10878231 |
Writing recognition using wearable pressure sensing device |
Katsuyuki Sakuma, Stephen J. Heisig, John J. Rice, Gaddi Blumrosen |
2020-12-29 |
$5,669,000 |
| 10833296 |
Thin film solid-state microbattery packaging |
Qianwen Chen, Bing Dang, Bo Wen |
2020-11-10 |
$848,000 |
| 10811305 |
Wafer level integration including design/co-design, structure process, equipment stress management, and thermal management |
Li-Wen Hung, Leathen Shi, Cornelia Tsang Yang, Bucknell C. Webb |
2020-10-20 |
$3,651,000 |
| 10750955 |
Health and fitness tracking |
Shriya Kumar |
2020-08-25 |
$2,454,000 |
| 10748877 |
Integrated wafer-level processing system |
Philip G. Emma, Hillery C. Hunter |
2020-08-18 |
$3,155,000 |
| 10694950 |
Probe structure for physiological measurements using surface enhanced Raman spectroscopy |
Emily R. Kinser, Roy R. Yu |
2020-06-30 |
$3,003,000 |
| 10694951 |
Probe structure for physiological measurements using surface enhanced Raman spectroscopy |
Emily R. Kinser, Roy R. Yu |
2020-06-30 |
$3,003,000 |
| 10687425 |
Method of forming a plurality of electro-optical module assemblies |
Paul S. Andry, Qianwen Chen, Bing Dang, Minhua Lu, Robert J. Polastre +1 more |
2020-06-16 |
$3,682,000 |
| 10679887 |
Handler bonding and debonding for semiconductor dies |
Paul S. Andry, Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung, Cornelia Tsang Yang |
2020-06-09 |
$2,264,000 |
| 10670656 |
Integrated electro-optical module assembly |
Paul S. Andry, Qianwen Chen, Bing Dang, Minhua Lu, Robert J. Polastre +1 more |
2020-06-02 |
$2,290,000 |
| 10658182 |
Chip handling and electronic component integration |
Russell A. Budd, Qianwen Chen, Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung |
2020-05-19 |
$2,035,000 |
| 10651036 |
Chip handling and electronic component integration |
Russell A. Budd, Qianwen Chen, Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung |
2020-05-12 |
$2,725,000 |
| 10651507 |
Miniaturized electronics package with patterned thin film solid state battery |
Qianwen Chen, Bing Dang |
2020-05-12 |
$2,725,000 |
| 10651134 |
Wafer level integration including design/co-design, structure process, equipment stress management and thermal management |
Jeffrey D. Gelorme, Li-Wen Hung |
2020-05-12 |
$2,725,000 |
| 10638613 |
Method of forming a plurality of electro-optical module assemblies |
Paul S. Andry, Qianwen Chen, Bing Dang, Minhua Lu, Robert J. Polastre +1 more |
2020-04-28 |
$4,123,000 |
| 10637101 |
Miniaturized electronics package with patterned thin film solid state battery |
Qianwen Chen, Bing Dang |
2020-04-28 |
$4,123,000 |
| 10621885 |
Wearable sensor monitoring and data analysis |
Shriya Kumar, Kang-Wook Lee, Minhua Lu |
2020-04-14 |
$1,668,000 |
| 10605741 |
Accurate colorimetric based test strip reader system |
Minhua Lu, Vince Siu, Russell A. Budd, Evan G. Colgan |
2020-03-31 |
$1,667,000 |
| 10586726 |
Handler bonding and debonding for semiconductor dies |
Paul S. Andry, Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung, Cornelia Tsang Yang |
2020-03-10 |
$1,254,000 |
| 10573538 |
Handler bonding and debonding for semiconductor dies |
Paul S. Andry, Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung, Cornelia Tsang Yang |
2020-02-25 |
$1,919,000 |
| 10546836 |
Wafer level integration including design/co-design, structure process, equipment stress management and thermal management |
Bing Dang, Li-Wen Hung, Jae-Woong Nah |
2020-01-28 |
$1,679,000 |
| 10531797 |
Wearable blood pressure monitoring system |
Hyung-Min Lee, Kang-Wook Lee |
2020-01-14 |
$2,827,000 |
