JK

John U. Knickerbocker

IBM: 22 patents #141 of 11,274Top 2%
Overall (2020): #1,694 of 565,922Top 1%
22
Patents 2020

Issued Patents 2020

Patent #TitleCo-InventorsDate
10878231 Writing recognition using wearable pressure sensing device Katsuyuki Sakuma, Stephen J. Heisig, John J. Rice, Gaddi Blumrosen 2020-12-29
10833296 Thin film solid-state microbattery packaging Qianwen Chen, Bing Dang, Bo Wen 2020-11-10
10811305 Wafer level integration including design/co-design, structure process, equipment stress management, and thermal management Li-Wen Hung, Leathen Shi, Cornelia Tsang Yang, Bucknell C. Webb 2020-10-20
10750955 Health and fitness tracking Shriya Kumar 2020-08-25
10748877 Integrated wafer-level processing system Philip G. Emma, Hillery C. Hunter 2020-08-18
10694950 Probe structure for physiological measurements using surface enhanced Raman spectroscopy Emily R. Kinser, Roy R. Yu 2020-06-30
10694951 Probe structure for physiological measurements using surface enhanced Raman spectroscopy Emily R. Kinser, Roy R. Yu 2020-06-30
10687425 Method of forming a plurality of electro-optical module assemblies Paul S. Andry, Qianwen Chen, Bing Dang, Minhua Lu, Robert J. Polastre +1 more 2020-06-16
10679887 Handler bonding and debonding for semiconductor dies Paul S. Andry, Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung, Cornelia Tsang Yang 2020-06-09
10670656 Integrated electro-optical module assembly Paul S. Andry, Qianwen Chen, Bing Dang, Minhua Lu, Robert J. Polastre +1 more 2020-06-02
10658182 Chip handling and electronic component integration Russell A. Budd, Qianwen Chen, Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung 2020-05-19
10651036 Chip handling and electronic component integration Russell A. Budd, Qianwen Chen, Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung 2020-05-12
10651507 Miniaturized electronics package with patterned thin film solid state battery Qianwen Chen, Bing Dang 2020-05-12
10651134 Wafer level integration including design/co-design, structure process, equipment stress management and thermal management Jeffrey D. Gelorme, Li-Wen Hung 2020-05-12
10638613 Method of forming a plurality of electro-optical module assemblies Paul S. Andry, Qianwen Chen, Bing Dang, Minhua Lu, Robert J. Polastre +1 more 2020-04-28
10637101 Miniaturized electronics package with patterned thin film solid state battery Qianwen Chen, Bing Dang 2020-04-28
10621885 Wearable sensor monitoring and data analysis Shriya Kumar, Kang-Wook Lee, Minhua Lu 2020-04-14
10605741 Accurate colorimetric based test strip reader system Minhua Lu, Vince Siu, Russell A. Budd, Evan G. Colgan 2020-03-31
10586726 Handler bonding and debonding for semiconductor dies Paul S. Andry, Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung, Cornelia Tsang Yang 2020-03-10
10573538 Handler bonding and debonding for semiconductor dies Paul S. Andry, Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung, Cornelia Tsang Yang 2020-02-25
10546836 Wafer level integration including design/co-design, structure process, equipment stress management and thermal management Bing Dang, Li-Wen Hung, Jae-Woong Nah 2020-01-28
10531797 Wearable blood pressure monitoring system Hyung-Min Lee, Kang-Wook Lee 2020-01-14