Issued Patents 2020
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879202 | System and method for forming solder bumps | Eric P. Lewandowski, Jeng-Bang Yau, Peter J. Sorce | 2020-12-29 |
| 10766086 | Injection-molded solder (IMS) tool assembly and method of use thereof | Claudius Feger, Bonnie L Glick | 2020-09-08 |
| 10740667 | Temperature triggered switch | Li-Wen Hung | 2020-08-11 |
| 10692795 | Flip chip assembly of quantum computing devices | Hanhee Paik, Jerry M. Chow | 2020-06-23 |
| 10692831 | Stud bumps for post-measurement qubit frequency modification | Nicholas Torleiv Bronn, Jared Barney Hertzberg, Eric P. Lewandowski | 2020-06-23 |
| 10679931 | Ball grid array and land grid array assemblies fabricated using temporary resist | Charles L. Reynolds, Katsuyuki Sakuma | 2020-06-09 |
| 10658267 | Metal cored solder decal structure and process | Peter A. Gruber | 2020-05-19 |
| 10581037 | Low-profile battery construct with engineered interfaces | Paul S. Andry, Paul A. Lauro, Adinath S. Narasgond, Robert J. Polastre, Bucknell C. Webb | 2020-03-03 |
| 10546836 | Wafer level integration including design/co-design, structure process, equipment stress management and thermal management | Bing Dang, Li-Wen Hung, John U. Knickerbocker | 2020-01-28 |
| 10535592 | Method for forming solder bumps using sacrificial layer | Eric P. Lewandowski, Peter J. Sorce | 2020-01-14 |