Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879202 | System and method for forming solder bumps | Eric P. Lewandowski, Jae-Woong Nah, Jeng-Bang Yau | 2020-12-29 |
| 10535592 | Method for forming solder bumps using sacrificial layer | Eric P. Lewandowski, Jae-Woong Nah | 2020-01-14 |