Issued Patents 2020
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10840214 | Carrier and integrated memory | Charles L. Arvin, Brian M. Erwin, Mark W. Kapfhammer, Brian W. Quinlan, Thomas Weiss | 2020-11-17 |
| 10813215 | Multi-layer circuit using metal layers as a moisture diffusion barrier for electrical performance | Jean Audet, Edmund Blackshear, Masahiro Fukui, Kenji Terada, Tomoyuki Yamada | 2020-10-20 |
| 10806030 | Multi-layer circuit using metal layers as a moisture diffusion barrier for electrical performance | Jean Audet, Edmund Blackshear, Masahiro Fukui, Kenji Terada, Tomoyuki Yamada | 2020-10-13 |
| 10756031 | Decoupling capacitor stiffener | Charles L. Arvin, Franklin M. Baez, Brian W. Quinlan, Krishna R. Tunga, Thomas Weiss | 2020-08-25 |
| 10687420 | Multi-layer circuit using metal layers as a moisture diffusion barrier for electrical performance | Jean Audet, Edmund Blackshear, Masahiro Fukui, Kenji Terada, Tomoyuki Yamada | 2020-06-16 |
| 10679931 | Ball grid array and land grid array assemblies fabricated using temporary resist | Jae-Woong Nah, Katsuyuki Sakuma | 2020-06-09 |
| 10660209 | Thin film capacitors for core and adjacent build up layers | Charles L. Arvin, Brian W. Quinlan, Jean Audet, Francesco Preda | 2020-05-19 |
| 10622299 | Multi terminal capacitor within input output path of semiconductor package interconnect | Charles L. Arvin, Jean Audet, Brian W. Quinlan, Brian R. Sundlof | 2020-04-14 |