Issued Patents 2020
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10840214 | Carrier and integrated memory | Brian M. Erwin, Mark W. Kapfhammer, Brian W. Quinlan, Charles L. Reynolds, Thomas Weiss | 2020-11-17 |
| 10833051 | Precision alignment of multi-chip high density interconnects | Thomas Weiss, Thomas A. Wassick, Steve Ostrander | 2020-11-10 |
| 10832987 | Managing thermal warpage of a laminate | Marcus E. Interrante, Thomas E. Lombardi, Hilton T. Toy, Krishna R. Tunga, Thomas Weiss | 2020-11-10 |
| 10818623 | Mixed UBM and mixed pitch on a single die | Christopher D. Muzzy | 2020-10-27 |
| 10804204 | Multi-chip package structure having chip interconnection bridge which provides power connections between chip and package substrate | Joshua M. Rubin, Lawrence A. Clevenger | 2020-10-13 |
| 10804241 | Non-porous copper to copper interconnect | Christopher D. Muzzy | 2020-10-13 |
| 10790253 | Conductive pillar shaped for solder confinement | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2020-09-29 |
| 10777482 | Multipart lid for a semiconductor package with multiple components | Steven P. Ostrander, Krishna R. Tunga | 2020-09-15 |
| 10756031 | Decoupling capacitor stiffener | Franklin M. Baez, Brian W. Quinlan, Charles L. Reynolds, Krishna R. Tunga, Thomas Weiss | 2020-08-25 |
| 10756041 | Finned contact | Brian M. Erwin, Clement Fortin, Chris Muzzy | 2020-08-25 |
| 10718062 | Prevent and remove organics from reservoir wells | Glen N. Biggs, Phillip W. Palmatier, Joseph C. Sorbello, Tracy A. Tong, Freddie Torres | 2020-07-21 |
| 10670653 | Integrated circuit tester probe contact liner | David M. Audette, Dennis R. Conti, Brian M. Erwin, Grant Wagner | 2020-06-02 |
| 10660209 | Thin film capacitors for core and adjacent build up layers | Brian W. Quinlan, Charles L. Reynolds, Jean Audet, Francesco Preda | 2020-05-19 |
| 10622299 | Multi terminal capacitor within input output path of semiconductor package interconnect | Jean Audet, Brian W. Quinlan, Charles L. Reynolds, Brian R. Sundlof | 2020-04-14 |
| 10615137 | Corrosion resistant aluminum bond pad structure | Jeffrey P. Gambino, Charles F. Musante, Christopher D. Muzzy, Wolfgang Sauter | 2020-04-07 |
| 10600751 | Conductive pillar shaped for solder confinement | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2020-03-24 |
| 10590561 | Continuous modification of organics in chemical baths | Christopher D. Muzzy | 2020-03-17 |
| 10586782 | Lead-free solder joining of electronic structures | Clement Fortin, Christopher D. Muzzy, Brian W. Quinlan, Thomas A. Wassick, Thomas Weiss | 2020-03-10 |
| 10580738 | Direct bonded heterogeneous integration packaging structures | Kamal K. Sikka, Jon A. Casey, Joshua M. Rubin, Arvind Kumar, Dinesh Gupta +5 more | 2020-03-03 |
| 10577703 | Separation of alpha emitting species from plating baths | Michael S. Gordon | 2020-03-03 |
| 10570527 | Continuous modification of organics in chemical baths | Christopher D. Muzzy | 2020-02-25 |
| 10566275 | Element place on laminates | Brian M. Erwin, Brian W. Quinlan | 2020-02-18 |
| 10553555 | Non-porous copper to copper interconnect | Christopher D. Muzzy | 2020-02-04 |
| 10535608 | Multi-chip package structure having chip interconnection bridge which provides power connections between chip and package substrate | Joshua M. Rubin, Lawrence A. Clevenger | 2020-01-14 |