| 10840214 |
Carrier and integrated memory |
Charles L. Arvin, Brian M. Erwin, Mark W. Kapfhammer, Brian W. Quinlan, Charles L. Reynolds |
2020-11-17 |
| 10832987 |
Managing thermal warpage of a laminate |
Charles L. Arvin, Marcus E. Interrante, Thomas E. Lombardi, Hilton T. Toy, Krishna R. Tunga |
2020-11-10 |
| 10833051 |
Precision alignment of multi-chip high density interconnects |
Charles L. Arvin, Thomas A. Wassick, Steve Ostrander |
2020-11-10 |
| 10756031 |
Decoupling capacitor stiffener |
Charles L. Arvin, Franklin M. Baez, Brian W. Quinlan, Charles L. Reynolds, Krishna R. Tunga |
2020-08-25 |
| 10636746 |
Method of forming an electronic package |
Kamal K. Sikka, Krishna R. Tunga, Hilton T. Toy, Shidong Li, Sushumna Iruvanti |
2020-04-28 |
| 10624202 |
Tamper-respondent assemblies with bond protection |
William L. Brodsky, James A. Busby, Zachary Thomas Dreiss, Michael J. Fisher, David C. Long +1 more |
2020-04-14 |
| 10586782 |
Lead-free solder joining of electronic structures |
Charles L. Arvin, Clement Fortin, Christopher D. Muzzy, Brian W. Quinlan, Thomas A. Wassick |
2020-03-10 |
