| 10832987 |
Managing thermal warpage of a laminate |
Charles L. Arvin, Marcus E. Interrante, Thomas E. Lombardi, Hilton T. Toy, Thomas Weiss |
2020-11-10 |
| 10777482 |
Multipart lid for a semiconductor package with multiple components |
Charles L. Arvin, Steven P. Ostrander |
2020-09-15 |
| 10770385 |
Connected plane stiffener within integrated circuit chip carrier |
Anson J. Call, Brian W. Quinlan |
2020-09-08 |
| 10756031 |
Decoupling capacitor stiffener |
Charles L. Arvin, Franklin M. Baez, Brian W. Quinlan, Charles L. Reynolds, Thomas Weiss |
2020-08-25 |
| 10665524 |
Electronic package cover having underside rib |
Kamal K. Sikka |
2020-05-26 |
| 10636746 |
Method of forming an electronic package |
Kamal K. Sikka, Hilton T. Toy, Thomas Weiss, Shidong Li, Sushumna Iruvanti |
2020-04-28 |
| 10622319 |
Final passivation for wafer level warpage and ULK stress reduction |
Ekta Misra |
2020-04-14 |
| 10622275 |
Electronic package cover having underside rib |
Kamal K. Sikka |
2020-04-14 |
| 10593639 |
Metal pad modification |
Ekta Misra |
2020-03-17 |
| 10541211 |
Control warpage in a semiconductor chip package |
Tuhin Sinha |
2020-01-21 |
