Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10622319 | Final passivation for wafer level warpage and ULK stress reduction | Krishna R. Tunga | 2020-04-14 |
| 10593639 | Metal pad modification | Krishna R. Tunga | 2020-03-17 |
EM
Ekta Misra
Overall (2020): #176,728 of 565,922Top 35%
2
Patents 2020