Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10804181 | Heterogeneous thermal interface material for corner and or edge degradation mitigation | Marcus E. Interrante, Sushumna Iruvanti, Shidong Li | 2020-10-13 |
| 10553503 | Method and structure for flip-chip package reliability monitoring using capacitive sensors groups | Taryn J. Davis, Jonathan Fry | 2020-02-04 |
| 10541156 | Multi integrated circuit chip carrier package | Marcus E. Interrante, Kathryn R. Lange, Kamal K. Sikka, Hilton T. Toy, Jeffrey A. Zitz | 2020-01-21 |
| 10541211 | Control warpage in a semiconductor chip package | Krishna R. Tunga | 2020-01-21 |