Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10832987 | Managing thermal warpage of a laminate | Charles L. Arvin, Thomas E. Lombardi, Hilton T. Toy, Krishna R. Tunga, Thomas Weiss | 2020-11-10 |
| 10804181 | Heterogeneous thermal interface material for corner and or edge degradation mitigation | Sushumna Iruvanti, Shidong Li, Tuhin Sinha | 2020-10-13 |
| 10541156 | Multi integrated circuit chip carrier package | Kathryn R. Lange, Kamal K. Sikka, Tuhin Sinha, Hilton T. Toy, Jeffrey A. Zitz | 2020-01-21 |