Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10770385 | Connected plane stiffener within integrated circuit chip carrier | Brian W. Quinlan, Krishna R. Tunga | 2020-09-08 |
| 10706204 | Automated generation of surface-mount package design | Jean Audet, Alain Ayotte, Franklin M. Baez, Deana Cosmadelis, Jason L. Frankel +5 more | 2020-07-07 |
| 10607928 | Reduction of laminate failure in integrated circuit (IC) device carrier | Sushumna Iruvanti, Shidong Li, Brian W. Quinlan, Kamal K. Sikka, Rui Wang | 2020-03-31 |
| 10546096 | Semiconductor package via stack checking | Paul R. Walling | 2020-01-28 |