Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10833025 | Compressive zone to reduce dicing defects | Kirk D. Peterson, Nicolas Pizzuti, Thomas M. Shaw | 2020-11-10 |
| 10833051 | Precision alignment of multi-chip high density interconnects | Charles L. Arvin, Thomas Weiss, Steve Ostrander | 2020-11-10 |
| 10755404 | Integrated circuit defect detection using pattern images | Chung-Ching Lin, Thomas M. Shaw, Peilin Song, Franco Stellari | 2020-08-25 |
| 10636750 | Step pyramid shaped structure to reduce dicing defects | Shidong Li, Kirk D. Peterson, Nicolas Pizzuti, Thomas M. Shaw | 2020-04-28 |
| 10586782 | Lead-free solder joining of electronic structures | Charles L. Arvin, Clement Fortin, Christopher D. Muzzy, Brian W. Quinlan, Thomas Weiss | 2020-03-10 |