Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10833025 | Compressive zone to reduce dicing defects | Kirk D. Peterson, Thomas A. Wassick, Nicolas Pizzuti | 2020-11-10 |
| 10818590 | Techniques to improve reliability in Cu interconnects using Cu intermetallics | Chao-Kun Hu, Christian Lavoie, Stephen M. Rossnagel | 2020-10-27 |
| 10755404 | Integrated circuit defect detection using pattern images | Chung-Ching Lin, Peilin Song, Franco Stellari, Thomas A. Wassick | 2020-08-25 |
| 10636750 | Step pyramid shaped structure to reduce dicing defects | Shidong Li, Kirk D. Peterson, Nicolas Pizzuti, Thomas A. Wassick | 2020-04-28 |