Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10818590 | Techniques to improve reliability in Cu interconnects using Cu intermetallics | Chao-Kun Hu, Christian Lavoie, Thomas M. Shaw | 2020-10-27 |
| 10720670 | Self-aligned 3D solid state thin film battery | Frank R. Libsch, Ghavam G. Shahidi, Ko-Tao Lee | 2020-07-21 |
| 10679853 | Self-aligned, over etched hard mask fabrication method and structure | Frank R. Libsch, Ghavam G. Shahidi, Ko-Tao Lee | 2020-06-09 |