Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10790253 | Conductive pillar shaped for solder confinement | Charles L. Arvin, Jeffrey P. Gambino, Christopher D. Muzzy | 2020-09-29 |
| 10748852 | Multi-chip module (MCM) with chip-to-chip connection redundancy and method | Mark W. Kuemerle, Edmund Blackshear | 2020-08-18 |
| 10714411 | Interconnected integrated circuit (IC) chip structure and packaging and method of forming same | Mark W. Kuemerle, Eric W. Tremble, David B. Stone, Nicholas A. Polomoff, Eric S. Parent +2 more | 2020-07-14 |
| 10615137 | Corrosion resistant aluminum bond pad structure | Charles L. Arvin, Jeffrey P. Gambino, Charles F. Musante, Christopher D. Muzzy | 2020-04-07 |
| 10600751 | Conductive pillar shaped for solder confinement | Charles L. Arvin, Jeffrey P. Gambino, Christopher D. Muzzy | 2020-03-24 |