Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10784137 | Package assembly for thin wafer shipping and method of use | Damyon L. Corbin | 2020-09-22 |
| 10622235 | Package assembly for thin wafer shipping and method of use | Damyon L. Corbin | 2020-04-14 |
| 10615137 | Corrosion resistant aluminum bond pad structure | Charles L. Arvin, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2020-04-07 |