Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10784137 | Package assembly for thin wafer shipping and method of use | Charles F. Musante | 2020-09-22 |
| 10622235 | Package assembly for thin wafer shipping and method of use | Charles F. Musante | 2020-04-14 |
DC
Damyon L. Corbin
Elpis Technologies: 1 patents #18 of 95Top 20%
Overall (2020): #182,299 of 565,922Top 35%
2
Patents 2020