Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10813215 | Multi-layer circuit using metal layers as a moisture diffusion barrier for electrical performance | Jean Audet, Masahiro Fukui, Charles L. Reynolds, Kenji Terada, Tomoyuki Yamada | 2020-10-20 |
| 10806030 | Multi-layer circuit using metal layers as a moisture diffusion barrier for electrical performance | Jean Audet, Masahiro Fukui, Charles L. Reynolds, Kenji Terada, Tomoyuki Yamada | 2020-10-13 |
| 10748852 | Multi-chip module (MCM) with chip-to-chip connection redundancy and method | Wolfgang Sauter, Mark W. Kuemerle | 2020-08-18 |
| 10687420 | Multi-layer circuit using metal layers as a moisture diffusion barrier for electrical performance | Jean Audet, Masahiro Fukui, Charles L. Reynolds, Kenji Terada, Tomoyuki Yamada | 2020-06-16 |
| 10598860 | Photonic die fan out package with edge fiber coupling interface and related methods | Koushik Ramachandran, Benjamin V. Fasano | 2020-03-24 |