Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10813215 | Multi-layer circuit using metal layers as a moisture diffusion barrier for electrical performance | Jean Audet, Edmund Blackshear, Masahiro Fukui, Charles L. Reynolds, Tomoyuki Yamada | 2020-10-20 |
| 10806030 | Multi-layer circuit using metal layers as a moisture diffusion barrier for electrical performance | Jean Audet, Edmund Blackshear, Masahiro Fukui, Charles L. Reynolds, Tomoyuki Yamada | 2020-10-13 |
| 10687420 | Multi-layer circuit using metal layers as a moisture diffusion barrier for electrical performance | Jean Audet, Edmund Blackshear, Masahiro Fukui, Charles L. Reynolds, Tomoyuki Yamada | 2020-06-16 |