Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10748852 | Multi-chip module (MCM) with chip-to-chip connection redundancy and method | Wolfgang Sauter, Edmund Blackshear | 2020-08-18 |
| 10714411 | Interconnected integrated circuit (IC) chip structure and packaging and method of forming same | Wolfgang Sauter, Eric W. Tremble, David B. Stone, Nicholas A. Polomoff, Eric S. Parent +2 more | 2020-07-14 |